Abstract: A system and method are provided for enhancing thermal performance of a heat transfer device. A fin pack is generated from a flat sheet of metal, the fin having a plurality of radiussed conduit top portions and a reciprocal plurality of radiussed conduit bottom portions, for transferring heat. The radiussed conduit bottom portions of the fin are attached to a base plate. The base plate comprises a series of grooves and risers for closely approximating the shape of the radiussed conduit portions. The radiussed fin portions nest in the configuration of grooves and risers to maximize the contact area between the fin and the base plate.

Abstract: A clamping heat sink formed of a thermally conductive material for releasable attachment to an electronic component. The clamping heat sink includes a horizontal base wall, a pair of vertical side walls extending upwardly from the base and a resiliently deflectable clamping element which extends downwardly from the top of each vertical wall into the rectangular channel which is formed by the base wall and vertical side walls. Each clamping element has an upper portion which extends downwardly at any angle toward the base wall and the opposite side wall and a lower portion which extends downwardly at an angle from the lower end of the upper portion toward its own side wall, the upper portion of the clamping element forming a juncture with the lower portion.

Abstract: A heat sink for frictionally engaging an electronic device. The heat sink includes an enclosure which is formed by a pair of oppositely facing vertically side walls which extend upwardly from a flat horizontal base wall. A pair of opposed resilient clamping fingers extend toward each other and downwardly from the upper ends of the vertical side walls. Each of the clamping fingers has a free rounded end for engaging with a downward biasing force the top surface of an electronic device which is placed within the enclosure of the heat sink. A stop is located on the base wall for locating the electronic device relative to the heat sink. The heat sink also has a protuberance on the inside surface of each vertical side wall for engaging the side walls of the electronic device.