Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include a hinge cover fixedly coupled to a hinge base. A plurality of rotation pivots may be rotatably coupled to the hinge base and the hinge cover. A housing of a computing device may be coupled to the rotation pivots, such that, as the rotation pivots rotate into the hinge base and hinge cover, the computing device is unfolded, and as the rotation pivots rotate out of the hinge base and hinge cover, the computing device is folded. Rotation of the rotation pivots into and out of the hinge base and hinge cover may be restricted by one or more stopping mechanisms, so as to maintain a foldable display of the computing device within allowable bending limits.

Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance traveled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Abstract: A flexible display that can be adjusted by an electromagnetic mechanism to remove a deformation is disclosed. The flexible display is attached to a body that is configurable in a folded configuration or an unfolded configuration by a hinge mechanism. When unfolded the flexible display includes a deformation (i.e., warp) in an area around the hinge mechanism. Accordingly, an electromagnet is included with the hinge mechanism to remove the deformation by attracting a magnetic element is disposed on a back surface of the flexible display.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include a hinge cover fixedly coupled to a hinge base. A plurality of rotation pivots may be rotatably coupled to the hinge base and the hinge cover. A housing of a computing device may be coupled to the rotation pivots, such that, as the rotation pivots rotate into the hinge base and hinge cover, the computing device is unfolded, and as the rotation pivots rotate out of the hinge base and hinge cover, the computing device is folded. Rotation of the rotation pivots into and out of the hinge base and hinge cover may be restricted by one or more stopping mechanisms, so as to maintain a foldable display of the computing device within allowable bending limits.

Abstract: A flexible display that can be adjusted by an electromagnetic mechanism to remove a deformation is disclosed. The flexible display is attached to a body that is configurable in a folded configuration or an unfolded configuration by a hinge mechanism. When unfolded the flexible display includes a deformation (i.e., warp) in an area around the hinge mechanism. Accordingly, an electromagnet is included with the hinge mechanism to remove the deformation by attracting a magnetic element is disposed on a back surface of the flexible display.

Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance traveled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Abstract: A buckle structure has a male and female buckle piece. The male buckle piece has a base mount having two symmetric retaining legs extending therefrom with a guiding post disposed therebetween. Each retaining leg has an enlarged head portion having a leading angle and a retaining corner. Each retaining leg has an abutment block. In the female buckle piece is defined a hollow engagement cavity for receiving retaining legs with a guiding tunnel disposed at the center for receiving the guiding post. The female buckle piece has a side dodging opening respectively for exposing the abutment block. A stop post located in the way of each retaining leg engages with the retaining corner in buckling up; actuation of the abutment block permits the retaining corner to escape from restraint, making buckle pieces to separate easily.