Abstract: Two metal plates have U-shaped grooves formed therein so that the plates may form congruent halves wherein matching grooves complete independent heat pipes. The bight section of each heat pipe serves as an evaporator section while the parallel arms of each heat pipe form condenser sections. A wick is positioned within each heat pipe to improve liquid transport when a module is in a non-upright position. The condenser sections are located coincident with the normally upright edges of each module so that, when the module is upright, the vertically disposed condenser sections of the heat pipe gravity-assist liquid transport to the evaporator section. This arrangement of heat pipe sections along with the wick render the heat pipe gravity-insensitive.

Abstract: A circuit card having the capability for the high-density packaging of electronic components thereon for use in high power-density card racks in computer and other electronic and avionic systems. The card has an all metal construction with an elongated planar body portion for the mounting of electronic components on the opposite sides thereof and has a heat pipe located along the edges of one elongated side and the two ends. A connector for making the required electrical connections to the electronic components is provided along the edge of the second elongated side. Edge tabs on the ends of the card permit the card to be installed into a card rack in electronic equipment. The elongated portion of the heat pipe serves as the evaporator region thereof and the two end portions act as the condensing regions.