Patents by Inventor Vincent Dang

Vincent Dang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260129500
    Abstract: An example system-on-chip (SoC) device for a communication system includes a peripheral component interconnect express (PCIe) interface configured to receive data from a backhaul field programmable gate array (FPGA) of the communication system, and a producer port linked with a consumer port through direct memory access (DMA). Data received by the PCIe interface is assigned to the producer port. The device includes dual hardware media access controls (MACs) configured to consume the data assigned to the producer port, and at least one processor configured to supply the data to a wireless interface for transmission to another wireless communication device of the communication system at a frequency of at least sixty Gigahertz.
    Type: Application
    Filed: January 6, 2026
    Publication date: May 7, 2026
    Inventors: Patrick SOON-SHIONG, Vincent DANG, Zaw SOE
  • Publication number: 20260122514
    Abstract: A communication system includes a first communication cable coupled with a first peer node of a data network, a first wireless host device including a first wireless interface and a second wireless interface, a first adapter coupled between the first wireless host device and an end point of the first communication cable, a second communication cable coupled with a second peer node of the data network, and a second wireless host device including a third wireless interface and a fourth wireless interface. The third wireless interface is configured to communicate with the first wireless interface via a first wireless communication channel, and the fourth wireless interface is configured to communicate with the second wireless interface via a second wireless communication channel. A second adapter is coupled between the second wireless host device and the second communication cable.
    Type: Application
    Filed: December 22, 2025
    Publication date: April 30, 2026
    Inventors: Patrick SOON-SHIONG, Vincent DANG
  • Patent number: 12538161
    Abstract: An example system-on-chip (SoC) device for a communication system includes a peripheral component interconnect express (PCIe) interface configured to receive data from a backhaul field programmable gate array (FPGA) of the communication system, and a producer port linked with a consumer port through direct memory access (DMA). Data received by the PCIe interface is assigned to the producer port. The device includes dual hardware media access controls (MACs) configured to consume the data assigned to the producer port, and at least one processor configured to supply the data to a wireless interface for transmission to another wireless communication device of the communication system at a frequency of at least sixty Gigahertz.
    Type: Grant
    Filed: December 16, 2024
    Date of Patent: January 27, 2026
    Assignee: Tensorcom, LLC
    Inventors: Patrick Soon-Shiong, Vincent Dang, Zaw Soe
  • Publication number: 20260025674
    Abstract: A communication system includes a first communication cable coupled with a first peer node of a data network, a first wireless host device including a first wireless interface and a second wireless interface, a first adapter coupled between the first wireless host device and an end point of the first communication cable, a second communication cable coupled with a second peer node of the data network, and a second wireless host device including a third wireless interface and a fourth wireless interface. The third wireless interface is configured to communicate with the first wireless interface via a first wireless communication channel, and the fourth wireless interface is configured to communicate with the second wireless interface via a second wireless communication channel. A second adapter is coupled between the second wireless host device and the second communication cable.
    Type: Application
    Filed: June 26, 2025
    Publication date: January 22, 2026
    Inventors: Patrick SOON-SHIONG, Vincent Dang
  • Publication number: 20260025702
    Abstract: An example system-on-chip (SoC) device for a communication system includes a peripheral component interconnect express (PCIe) interface configured to receive data from a backhaul field programmable gate array (FPGA) of the communication system, and a producer port linked with a consumer port through direct memory access (DMA). Data received by the PCIe interface is assigned to the producer port. The device includes dual hardware media access controls (MACs) configured to consume the data assigned to the producer port, and at least one processor configured to supply the data to a wireless interface for transmission to another wireless communication device of the communication system at a frequency of at least sixty Gigahertz.
    Type: Application
    Filed: December 16, 2024
    Publication date: January 22, 2026
    Inventors: Patrick SOON-SHIONG, Vincent Dang, Zaw Soe
  • Patent number: 12532196
    Abstract: A communication system includes a first communication cable coupled with a first peer node of a data network, a first wireless host device including a first wireless interface and a second wireless interface, a first adapter coupled between the first wireless host device and an end point of the first communication cable, a second communication cable coupled with a second peer node of the data network, and a second wireless host device including a third wireless interface and a fourth wireless interface. The third wireless interface is configured to communicate with the first wireless interface via a first wireless communication channel, and the fourth wireless interface is configured to communicate with the second wireless interface via a second wireless communication channel. A second adapter is coupled between the second wireless host device and the second communication cable.
    Type: Grant
    Filed: June 26, 2025
    Date of Patent: January 20, 2026
    Assignee: Tensorcom, LLC
    Inventors: Patrick Soon-Shiong, Vincent Dang
  • Patent number: 12369052
    Abstract: A communication system includes a first communication cable coupled with a first peer node of a data network, a first wireless host device including a first wireless interface and a second wireless interface, a first adapter coupled between the first wireless host device and an end point of the first communication cable, a second communication cable coupled with a second peer node of the data network, and a second wireless host device including a third wireless interface and a fourth wireless interface. The third wireless interface is configured to communicate with the first wireless interface via a first wireless communication channel, and the fourth wireless interface is configured to communicate with the second wireless interface via a second wireless communication channel. A second adapter is coupled between the second wireless host device and the second communication cable.
    Type: Grant
    Filed: December 16, 2024
    Date of Patent: July 22, 2025
    Assignee: Tensorcom, Inc.
    Inventors: Patrick Soon-Shiong, Vincent Dang
  • Patent number: 7240312
    Abstract: In one embodiment, the present invention includes a method for obtaining a physical layout for an integrated circuit (IC) design of a substrate having at least one of an n-well and a deep n-well; and extracting a layout netlist for the IC design from the physical layout by identifying the substrate as a single region. In such manner, short circuits isolated by the n-well or the deep n-well can be detected.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: July 3, 2007
    Assignee: Silicon Laboratories Inc.
    Inventors: Vincent Dang, Harry A. Levanti
  • Publication number: 20060230368
    Abstract: In one embodiment, the present invention includes a method for obtaining a physical layout for an integrated circuit (IC) design of a substrate having at least one of an n-well and a deep n-well; and extracting a layout netlist for the IC design from the physical layout by identifying the substrate as a single region. In such manner, short circuits isolated by the n-well or the deep n-well can be detected.
    Type: Application
    Filed: March 22, 2005
    Publication date: October 12, 2006
    Inventors: Vincent Dang, Harry Levanti