Abstract: A pinchuck is formed in accordance with this invention by using lithographic techniques to define and to etch a pattern of pins from an extremely flat etchable surface. Since the pins are formed from a surface which is already flat, it is not necessary to level or polish the pins after they are formed. Since lithographic techniques are used, the pin head dimensions, the number of pins, the arrangement of pins, and the density of pins all may be freely chosen without affecting the fabrication cost. By surrounding the region of etched pins with an unetched band, a raised peripheral ring will be formed which can act as a vacuum sealing ring when the pinchuck is used as a vacuum pinchuck. By fabricating the pins from an electrically conductive material (such as doped silicon) and then covering the pins with a dielectric film (such as silicon dioxide), the pinchuck can be used as an electrostatic pinchuck.