Patents by Inventor Vincent F. Riviezzo

Vincent F. Riviezzo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4482197
    Abstract: A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more than 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation.
    Type: Grant
    Filed: October 29, 1982
    Date of Patent: November 13, 1984
    Assignee: AT&T Technologies, Inc.
    Inventors: Paul J. Ouellette, Vincent F. Riviezzo