Abstract: A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape by a die eject pin to permt the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.

Abstract: An end effector or centering chuck is disclosed having centering fingers which employ a linear sliding motion. A stepper motor is mounted on the centering chuck and controls the opening and closing of the centering fingers. The stepper motor is controlled such that the centering fingers decelerate as they approach the work to be centered. The X-axis fingers, for example, are moved into engagement with the work to be centered with the Y-axis fingers disengaged. After alignment in the X direction is achieved, the work is centered in the Y-axis direction with the Y fingers while the X fingers are disengaged.

Abstract: A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape supporting the preselected die. The adhesive tape is pre-peeled and pulled away from the preselected die which subsequently is further separated from the adhesive tape by a die eject pin to permit the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.

Abstract: The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is mounted on a retractable pedestal which is vertically and rotationally movable by a high speed vertical axis drive motor and a high speed theta drive motor which are mounted on a workstation base in fixed positions and coupled to said pedestal for imparting motion thereto. The movable pedestal and workstation are adapted to unload a semiconductor device from a boat or holder and accurately position the top of the semiconductor device at a predetermined bonding height opposite the bonding tool.