Patents by Inventor Vincent J. Andrews

Vincent J. Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making wear-resistant printed wiring member
    Patent number: 8801914
    Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: August 12, 2014
    Assignee: Eastman Kodak Company
    Inventors: Samuel Chen, Allan F. Camp, Charles I. Levey, Vincent J. Andrews
  • METHOD OF MAKING WEAR-RESISTANT PRINTED WIRING MEMBER
    Publication number: 20120298517
    Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 29, 2012
    Inventors: Samuel Chen, Allan F. Camp, Charles I. Levey, Vincent J. Andrews