Patents by Inventor Vincent J. Lyons

Vincent J. Lyons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming compound semiconductor bodies
    Patent number: 4261781
    Abstract: Compound semiconductor bodies are formed by bonding a layer of supporting material to the two opposite faces of a semiconductor wafer and then cutting the semiconductor wafer into two parts in a plane parallel to said faces. The cut surface of each part is then polished.
    Type: Grant
    Filed: January 31, 1979
    Date of Patent: April 14, 1981
    Assignee: International Business Machines Corporation
    Inventors: Harold D. Edmonds, Vincent J. Lyons, Gary Markovits