Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Abstract: The present disclosure discloses a human-machine interaction method and system based on eye movement tracking. The human-machine interaction method comprises the following steps: acquiring first eye movement information of a user on a current display interface; executing a first operation command on the current display interface based on the first eye movement information; acquiring second eye movement information of the user on the current display interface under the first operation command; executing a second operation command on the current display interface under the first operation command based on the second eye movement information; acquiring third eye movement information of the user on the current display interface under the second operation command; locking or unlocking the second operation command based on the third eye movement information; and repeating the above process until the user finishes human-machine interaction.

Abstract: The present disclosure discloses a human-machine interaction method and system based on eye movement tracking. The human-machine interaction method comprises the following steps: acquiring first eye movement information of a user on a current display interface; executing a first operation command on the current display interface based on the first eye movement information; acquiring second eye movement information of the user on the current display interface under the first operation command; executing a second operation command on the current display interface under the first operation command based on the second eye movement information; acquiring third eye movement information of the user on the current display interface under the second operation command; locking or unlocking the second operation command based on the third eye movement information; and repeating the above process until the user finishes human-machine interaction.

Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.