Patents by Inventor Vincent Joseph Zaleckas

Vincent Joseph Zaleckas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming substrate terminal areas for bonded leads
    Patent number: 4091529
    Abstract: A plurality of separate metallized regions on a substrate form a bondsite for a single lead to be bonded to the substrate. The metallized regions are electrically interconnected at a point removed from the bondsite. Such multiple metallized regions offer redundant bonds for each such lead to improve the mechanical strength and to improve the reliability of the bond between the lead and the substrate.
    Type: Grant
    Filed: February 23, 1977
    Date of Patent: May 30, 1978
    Assignee: Western Electric Co., Inc.
    Inventor: Vincent Joseph Zaleckas
  • Removal of thin films from substrates by laser induced explosion
    Patent number: 4081653
    Abstract: Selected portions of a thin film coating of metal are removed from an insulative substrate by directing a coherent beam of light energy from a laser at the coating, to heat the coating and cause the evaporation and entrapment of the substrate material at the coating-substrate interface. A positive pressure builds up at the interface resulting in an explosion which removes the coating material.
    Type: Grant
    Filed: December 27, 1976
    Date of Patent: March 28, 1978
    Assignee: Western Electric Co., Inc.
    Inventors: Jackson Chik-Yun Koo, Vincent Joseph Zaleckas
  • Substrate terminal areas for bonded leads
    Patent number: 4034149
    Abstract: A plurality of separate metallized regions on a substrate form a bondsite for a single lead to be bonded to the substrate. The metallized regions are electrically interconnected at a point removed from the bondsite. Such multiple metallized regions offer redundant bonds for each such lead to improve the mechanical strength and to improve the reliability of the bond between the lead and the substrate.
    Type: Grant
    Filed: October 20, 1975
    Date of Patent: July 5, 1977
    Assignee: Western Electric Company, Inc.
    Inventor: Vincent Joseph Zaleckas