Patents by Inventor Vincent Kao

Vincent Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating high performance leadframe in electronic package
    Patent number: 7528013
    Abstract: Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current operation. The extended area can be an extended portion of a single lead in a single-layer non-leaded leadframe, where multiple wires are connected between multiple bond pads and the single lead. The extended area can be a support bar of a leadframe that is used as bond area for ground connections in a single-layer non-leaded leadframe. The extended area can be lead regions used for wire bonding voltage output and voltage input using a reduced power dissipation topology.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: May 5, 2009
    Assignee: Marvell International Ltd.
    Inventors: Sehat Sutardja, Vincent Kao, Hendrick Santo
  • High performance leadframe in electronic package
    Patent number: 6903448
    Abstract: Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current operation. The extended area can be an extended portion of a single lead in a single-layer non-leaded leadframe, where multiple wires are connected between multiple bond pads and the single lead. The extended area can be a support bar of a leadframe that is used as bond area for ground connections in a single-layer non-leaded leadframe. The extended area can be lead regions used for wire bonding voltage output and voltage input using a reduced power dissipation topology.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: June 7, 2005
    Assignee: Marvell International Ltd.
    Inventors: Sehat Sutardja, Vincent Kao, Hendrick Santo