Patents by Inventor Vincent Kirchhoff

Vincent Kirchhoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for gas delivery in semiconductor process chambers
    Patent number: 11380557
    Abstract: Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: July 5, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vincent Kirchhoff, Faruk Gungor, Felix Rabinovich, Gary Keppers
  • APPARATUS AND METHOD FOR GAS DELIVERY IN SEMICONDUCTOR PROCESS CHAMBERS
    Publication number: 20180350627
    Abstract: Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.
    Type: Application
    Filed: June 5, 2017
    Publication date: December 6, 2018
    Inventors: Vincent Kirchhoff, Faruk Gungor, Felix Rabinovich, Gary Keppers
  • Method of diffusion bonding a fluid flow apparatus
    Patent number: 7798388
    Abstract: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: September 21, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath
  • Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure
    Publication number: 20090072009
    Abstract: The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process.
    Type: Application
    Filed: October 21, 2008
    Publication date: March 19, 2009
    Inventors: Mark Crockett, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath
  • Method of improving surface roughness of fluid flow conduits within a diffusion bonded fluid flow structure
    Publication number: 20090057375
    Abstract: The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.
    Type: Application
    Filed: October 21, 2008
    Publication date: March 5, 2009
    Inventors: Mark Crockett, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath
  • STAINLESS STEEL OR STAINLESS STEEL ALLOY FOR DIFFUSION BONDING
    Publication number: 20080296354
    Abstract: The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 4, 2008
    Inventors: MARK CROCKETT, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath
  • DIFFUSION BONDED FLUID FLOW APPARATUS USEFUL IN SEMICONDUCTOR MANUFACTURING
    Publication number: 20080296351
    Abstract: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 4, 2008
    Inventors: Mark Crockett, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath