Patents by Inventor Vincent M. Fiacco

Vincent M. Fiacco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5530291
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages fully assemble. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: June 25, 1996
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 5468996
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: November 21, 1995
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 4863395
    Abstract: A zero insertion force connector system with a top entry for improved interconnection with a component card and a component card positioner for providing an interconnectable structure that is useable with adjacent apparatus. The zero insertion force connector system includes a housing with a card guide channel having a top entry and a sliding cam system for interlocking the component card positioner and the component card in an improved manner. The component card positioner includes a card positioning structure with a tab cover structure and a card guide channel positioner for interaction with the sliding cam system of the zero insertion force connector system to properly interconnect the component card. The component card includes card contact tabs protected by a tab cover structure in the component card positioner and related to connector contacts positioned in the housing of the connector.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: September 5, 1989
    Inventors: Robert Babuka, Vincent M. Fiacco, John L. Piechota