Patents by Inventor Vincent Matthew Hedrick

Vincent Matthew Hedrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a layered polishing pad
    Patent number: 7132033
    Abstract: A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: November 7, 2006
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Mark J. Boldizar, Robert T. Gamble, Vincent Matthew Hedrick, Jason M. Lawhorn, Alan H. Saikin, Katherine L. Tome