Abstract: The present invention relates to a process for electroplating a zinc-nickel alloy on a substrate, including electroplating the substrate in an aqueous zinc-nickel electroplating bath, including water; nickel ion; zinc ion; at least one complexing agent; and at least one non-ionogenic, surface active polyoxyalkylene compound, wherein the bath has an alkaline pH. In one embodiment, the zinc ion, the nickel ion and the non-ionogenic surface active polyoxyalkylene compound are present at concentrations sufficient to deposit a zinc-nickel alloy comprising a substantially gamma phase.

Abstract: An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.

Abstract: The present invention relates to an aqueous zinc-nickel electroplating bath, including water; nickel ion; zinc ion; at least one complexing agent; and at least one non-ionogenic, surface active polyoxyalkylene compound, wherein the bath has an alkaline pH. In one embodiment, the zinc ion, the nickel ion and the non-ionogenic surface active polyoxyalkylene compound are present at concentrations sufficient to deposit a zinc-nickel alloy comprising a substantially gamma phase.

Abstract: The present invention relates to an apparatus and a process for electrolytically treating a metal surface. The apparatus includes an electrochemical cell which includes an anodic chamber, a cathodic chamber, and a divider separating the anodic chamber from the cathodic chamber. The anodic chamber has an anode and contains a conductive anodic medium. The cathodic chamber has, as a cathode, the metal surface to be treated, and contains a conductive cathodic medium including a silica compound. In one embodiment, during operation of the apparatus, the anode remains substantially free of accumulation of foreign materials. In another embodiment, during operation of the apparatus, organic or inorganic compounds in the conductive cathodic medium remain substantially free of oxidation by the anode. In one embodiment, the treating comprises deposition of a silicon-containing mineral on the metal surface.