Abstract: Locator device for locating modular electronic components centrally with respect to a nozzle of an apparatus for attaching the components to a substrate, such as a printed circuit board. The locator device comprises a component support member for supporting a component to be located centrally with respect to the nozzle of a component attachment apparatus, and a component centralizing element associated with the component support member and engageable with the nozzle for centralizing the component with respect to the nozzle prior to soldering of the component to the printed circuit board. When the component has been centralized with respect to the nozzle, the component is maintained in its centralized position by attachment to a source of vacuum disposed within the nozzle. This facilitates removal of the locator device from the nozzle to leave the component disposed centrally within the nozzle attached to the source of vacuum and ready for installation on the printed circuit board.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a printed circuit board for melting solder or the like thereon. The device comprises two heat exchange elements having at least one passage through which fluid to be heated passes. A stainless steel etched foil heater is disposed in a plane between the first and second heat exchange elements, and a fluid entry port is provided in flow communication with the first and second heat exchange elements for admitting fluid to be heated into the at least one passage. A fluid exit port is provided in flow communication with the at least one passage for passing heated fluid from the passage to the substrate to melt the solder or the like thereon. The fluid entering through the fluid entry port and exiting through the fluid exit port flows in generally the same direction as the plane of the heater.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a printed circuit board or removal therefrom. The device comprises two heat exchange elements having a stainless steel etched foil heater sandwiched therebetween. Each heat exchange element is approximately square in configuration, and has a passageway extending from an outer peripheral point of each element about a central axis parallel to the four sides of each element toward the center. The heat exchange elements may be connected for serial flow whereby air to be heated passes along the passageway of one element and then enters the second heat exchange element and passes through that element and exits therefrom, or for parallel flow whereby a first stream of air to be heated passes through one of the elements and a second stream of air to be heated passes through the second heat exchange element.

Abstract: Nozzle structure suitable for bringing heated fluid into contact with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a substrate or removal therefrom. The nozzle structure comprises a conduit forming member engageable with the component and with the substrate to form a heated fluid conduit extending around the periphery of the component, and a heated fluid delivery conduit coupled to the conduit forming member for delivering heated fluid to the heated fluid conduit to effect melting of solder or the like at the terminals of the component.