Patents by Inventor Vincent P. Marzen
Vincent P. Marzen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9573327Abstract: The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.Type: GrantFiled: November 1, 2013Date of Patent: February 21, 2017Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8936057Abstract: The present disclosure is directed to a substrate lamination system and method. A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support. A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.Type: GrantFiled: January 18, 2008Date of Patent: January 20, 2015Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8746311Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: GrantFiled: September 5, 2013Date of Patent: June 10, 2014Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8691043Abstract: The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.Type: GrantFiled: January 18, 2008Date of Patent: April 8, 2014Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20140057012Abstract: The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.Type: ApplicationFiled: November 1, 2013Publication date: February 27, 2014Applicant: ROCKWELL COLLINS, INC.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8603288Abstract: The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.Type: GrantFiled: January 18, 2008Date of Patent: December 10, 2013Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8540002Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: GrantFiled: March 14, 2012Date of Patent: September 24, 2013Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20120275024Abstract: A film assembly includes a polarizer having a first side and a second side opposite the first side; a first layer of adhesive bonded to the first side of the polarizer; and a second layer of adhesive bonded to a second side of the polarizer. The first and second layers of adhesive and the polarizer form a rollable film.Type: ApplicationFiled: April 27, 2011Publication date: November 1, 2012Inventors: Vincent P. Marzen, James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge
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Publication number: 20120168086Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: ApplicationFiled: March 14, 2012Publication date: July 5, 2012Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8137498Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: GrantFiled: January 18, 2008Date of Patent: March 20, 2012Assignee: Rockwell Collins Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 8118075Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.Type: GrantFiled: January 18, 2008Date of Patent: February 21, 2012Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 7814676Abstract: A method for alignment comprises calculating the proper alignment position for a plurality of planar items based on at least one datum per planar item of the plurality of planar items, instructing a tooling system to form a tooling aid for providing the proper alignment position in a planar substrate lamination apparatus, and inserting the tooling aid into the planar substrate lamination apparatus for the proper alignment of the plurality of planar items in the planar substrate lamination apparatus.Type: GrantFiled: January 18, 2008Date of Patent: October 19, 2010Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Patent number: 7573466Abstract: A touch screen for LCDs which uses a plurality of shockwave detectors disposed around the periphery of the viewing area to detect the location of a touch or tap which is the point of origin of an expanding shockwave.Type: GrantFiled: September 17, 2003Date of Patent: August 11, 2009Assignee: Rockwell Collins, Inc.Inventors: Vincent P. Marzen, Albert N. Stuppi, Gary D. Bishop, Birendra Bahadur, Michael R. Jones
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Patent number: 7566254Abstract: A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.Type: GrantFiled: August 30, 2005Date of Patent: July 28, 2009Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Vincent P. Marzen
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Publication number: 20090183381Abstract: A method for alignment comprises calculating the proper alignment position for a plurality of planar items based on at least one datum per planar item of the plurality of planar items, instructing a tooling system to form a tooling aid for providing the proper alignment position in a planar substrate lamination apparatus, and inserting the tooling aid into the planar substrate lamination apparatus for the proper alignment of the plurality of planar items in the planar substrate lamination apparatus.Type: ApplicationFiled: January 18, 2008Publication date: July 23, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20090183615Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.Type: ApplicationFiled: January 18, 2008Publication date: July 23, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20090186218Abstract: The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.Type: ApplicationFiled: January 18, 2008Publication date: July 23, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20090126872Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: ApplicationFiled: January 18, 2008Publication date: May 21, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20090120572Abstract: The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate.Type: ApplicationFiled: January 18, 2008Publication date: May 14, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20090120585Abstract: The present disclosure is directed to a substrate lamination system and method. A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support. A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.Type: ApplicationFiled: January 18, 2008Publication date: May 14, 2009Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen