Patents by Inventor Vincent P. Siuta

Vincent P. Siuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making thick film/solder joints
    Patent number: 5202153
    Abstract: A method for making a thick film/solder joint comprising the sequential steps of:(1) applying a layer of first thick film conductor paste to an electrically non-conductive substrate in a pattern which has preselected solder pad areas and firing the layer;(2) applying over the first thick film layer only within the solder pad area a layer of a second thick film conductor paste having a low frit content and firing the layer; and(3) forming the solder joint by applying to the fired second thick film layer a layer of soft solder.
    Type: Grant
    Filed: August 23, 1991
    Date of Patent: April 13, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta
  • Thick film electronic materials
    Patent number: 4780248
    Abstract: Thick film electronic compositions comprising finely divided particles of electrically functional material and a PbO-compatible inorganic binder dispersed in an organic medium in which 0.1 to 10.0% wt. lead nitrate is coated on the surface of at least one of the solide components.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: October 25, 1988
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Paul C. Donohue, Vincent P. Siuta
  • Copper conductor compositions
    Patent number: 4687597
    Abstract: A fritless copper conductor composition suitable for overprinting on copper consisting essentially of (a) 10-50% wt. finely divided copper particles, (b) 90-50% wt. coarse copper particles, (c) 0.2-2% wt. reducible heavy metal oxide, (d) 0-1.0% refractory metal and (e) 0-5.0% of a high surface area noble metal, all the particles being dispersed in an organic medium.
    Type: Grant
    Filed: January 29, 1986
    Date of Patent: August 18, 1987
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta
  • Metal oxide-coated copper powder
    Patent number: 4600604
    Abstract: Particles of Cu-containing metal having a particle size of 0.5-20 .mu.m in largest dimension bearing a thin, substantially continuous coating of at least one metal oxide having a free energy of formation more negative than -98 kcal/mole and method of making them. The metal oxide-coated particles have improved sintering and shrinking properties which closely match those of green ceramic tape.
    Type: Grant
    Filed: September 30, 1985
    Date of Patent: July 15, 1986
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta
  • Metal oxide-coated copper powder
    Patent number: 4594181
    Abstract: Particles of Cu-containing metal having a particle size of 0.5-20 .mu.m in largest dimension bearing a thin, substantially continuous coating of at least one metal oxide having a free energy of formation more negative than -98 kcal/mole and method of making them. The metal oxide-coated particles have improved sintering and shrinking properties which closely match those of green ceramic tape.
    Type: Grant
    Filed: September 17, 1984
    Date of Patent: June 10, 1986
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta
  • Thick film conductor compositions
    Patent number: 4540604
    Abstract: A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.
    Type: Grant
    Filed: January 10, 1985
    Date of Patent: September 10, 1985
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta
  • Copper conductor compositions
    Patent number: 4521329
    Abstract: Thick film conductor compositions comprising finely divided particles of copper oxide-coated copper and low softening point inorganic binder dispersed in a low-resin organic medium. Additional copper oxide is incorporated into the composition by either direct addition or by inclusion in the inorganic binder.
    Type: Grant
    Filed: June 20, 1983
    Date of Patent: June 4, 1985
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Vincent P. Siuta, Joel Slutsky
  • Thick film conductor compositions
    Patent number: 4514321
    Abstract: A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: April 30, 1985
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Vincent P. Siuta