Patents by Inventor Vincent PHAN

Vincent PHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transmission line structure and method of attaching transmission line structure to conductive body
    Patent number: 9730312
    Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: August 8, 2017
    Assignee: Nokia Technologies Oy
    Inventors: Romeo Dumpit, Rolf G. Laido, Mikko J. Timperi, Vincent Phan, Toni Kyroenlampi, Jani Haapamaki, Tim McGaffigan
  • Apparatus and method for improving thermal energy transfer
    Publication number: 20150092336
    Abstract: An apparatus or method for providing thermal energy transfer comprising; a circuit board, a housing connected to the circuit board, at least one electronic component contained within said housing, said housing comprising a aperture, wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: Nokia Corporation
    Inventors: Mezhgan SAMADY, Mikko Juhani TIMPERI, Romeo DUMPIT, Vincent PHAN, Cachaulo VAN LAANEN
  • Transmission Line Structure and Method of Attaching Transmission Line Structure to Conductive Body
    Publication number: 20150092364
    Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.
    Type: Application
    Filed: September 26, 2014
    Publication date: April 2, 2015
    Inventors: Romeo Dumpit, Rolf G. Laido, Mikko J. Timperi, Vincent Phan, Toni Kyroenlampi, Jani Haapamaki, Tim McGaffigan