Abstract: An improved hybrid composite projectile barrel comprising an inner liner and an outer composite matrix, the inner liner having a breech transition region and a muzzle transition region. The breech transition region and the muzzle transition region each comprises locking features that secure the outer composite matrix to the inner liner at the transition regions. In a first embodiment, the locking features are a series of longitudinally extending ribs with notches. In a second embodiment, the locking features are a plurality of pins disposed around the circumference of the breech and muzzle transition regions. In a third embodiment, the ridges and pins are combined such that a pin extends from the top of each ridge. In each embodiment with pins, the height of the pins is preferably adjusted so that the top ends of the pins form a line that is parallel with the outer diameter of the inner liner.

Abstract: An improved hybrid composite projectile barrel comprising an inner liner and an outer composite matrix, the inner liner having a breech transition region and a muzzle transition region. The breech transition region and the muzzle transition region each comprises locking features that secure the outer composite matrix to the inner liner at the transition regions. In a first embodiment, the locking features are a series of longitudinally extending ribs with notches. In a second embodiment, the locking features are a plurality of pins disposed around the circumference of the breech and muzzle transition regions. In a third embodiment, the ridges and pins are combined such that a pin extends from the top of each ridge. In each embodiment with pins, the height of the pins is preferably adjusted so that the top ends of the pins form a line that is parallel with the outer diameter of the inner liner.

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract: A processing apparatus may include a down-facing substrate processing chamber fixed at acute angle to horizontal. A chuck plate on a platform may pivot from an open position wherein the platform is at an acute angle to the processing chamber, to a parallel position wherein the platform is parallel to the processing chamber. The chuck plate may then be moved linearly into sealing engagement with the processing chamber. A chuck holder may be provided on the platform to hold the chuck in place.

Abstract: A high throughput stand-alone anneal system has a horizontal row of docking stations at a front wall of an enclosure. A rack in the enclosure has a plurality of vertically stacked anneal modules. Robots within the enclosure move wafers from the docking stations to one of the anneal modules for rapid thermal anneal processing.

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract: A processing apparatus may include a down-facing substrate processing chamber fixed at acute angle to horizontal. A chuck plate on a platform may pivot from an open position wherein the platform is at an acute angle to the processing chamber, to a parallel position wherein the platform is parallel to the processing chamber. The chuck plate may then be moved linearly into sealing engagement with the processing chamber. A chuck holder may be provided on the platform to hold the chuck in place.

Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.