Patents by Inventor Vincent T. Cordasco

Vincent T. Cordasco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating metal conductors and multi-level interconnects in a semiconductor device
    Patent number: 6677232
    Abstract: A method for fabricating a metal conductor in a semiconductor device includes forming a trench in a dielectric layer of the semiconductor device. The method also includes depositing a first conducting material within the trench to form a continuous liner layer within the trench. The liner layer is formed at a first predetermined temperature. The method further includes filling a remaining portion of the trench over the liner layer with a second conducting material at a second predetermined temperature. The second predetermined temperature is greater than the first predetermined temperature.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: January 13, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Qi-Zhong Hong, Wei-Yung Hsu, Vincent T. Cordasco
  • Method for fabricating metal conductors and multi-level interconnects in a semiconductor device
    Publication number: 20020081837
    Abstract: A method for fabricating a metal conductor in a semiconductor device includes forming a trench in a dielectric layer of the semiconductor device. The method also includes depositing a first conducting material within the trench to form a continuous liner layer within the trench. The liner layer is formed at a first predetermined temperature. The method further includes filling a remaining portion of the trench over the liner layer with a second conducting material at a second predetermined temperature. The second predetermined temperature is greater than the first predetermined temperature.
    Type: Application
    Filed: November 1, 2001
    Publication date: June 27, 2002
    Inventors: Qi-Zhong Hong, Wei-Yung Hsu, Vincent T. Cordasco