Abstract: A power module disclosed in the invention has a controller chip and a power chip disposed on a same die pad, which can be a standard die pad commonly seen in the industry so that a extra cost of making and designing a die pad especially for the power module can be saved. Moreover, since the controller chip can use a manufacturing process different than that of the power chip, the overall size of the power module of the invention is minimized by adopting two optimal manufacturing processes respective for making the controller chip and the power chip as small as possible.