Patents by Inventor Vincent Utsi

Vincent Utsi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless communication with a medical implant
    Patent number: 8718787
    Abstract: An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 6, 2014
    Assignee: MicroCHIPS, Inc.
    Inventors: Vincent Utsi, Mark Norris, Jean-Daniel Richerd
  • WIRELESS COMMUNICATION WITH A MEDICAL IMPLANT
    Publication number: 20130002496
    Abstract: An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
    Type: Application
    Filed: September 11, 2012
    Publication date: January 3, 2013
    Applicant: MICROCHIPS, INC.
    Inventors: Vincent Utsi, Mark Norris, Jean-Daniel Richerd
  • Wireless communication with a medical implant
    Patent number: 8285387
    Abstract: An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: October 9, 2012
    Assignee: MicroCHIPS, Inc.
    Inventors: Vincent Utsi, Mark Norris, Jean-Daniel Richerd
  • WIRELESS COMMUNICATION WITH A MEDICAL IMPLANT
    Publication number: 20100149042
    Abstract: An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 17, 2010
    Applicant: MICROCHIPS, INC.
    Inventors: Vincent Utsi, Mark Norris, Jean-Daniel Richerd