Abstract: An optical engine for data communication includes a substrate, an array of optical semiconductor devices mounted on the substrate, a device lens block mounted on the substrate and formed with a cavity for accommodating the array of optical semiconductor devices, a jumper lens block coupled with the device lens block at an upper surface thereof, and a fiber array mounted on the jumper lens block and optically coupled with the array of optical semiconductor devices. The jumper lens block is aligned with the device lens block by alignment posts and notches. A metal latch is used to hold the jumper lens block on the device lens block.

Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Abstract: An optical transmitter module includes a coupling optical element configured to couple a first optical signal from a transmitting optoelectronic component to a first light guiding structure. An optical power monitor system is connected with the first light guiding structure and is provided with a beam splitter for splitting the first optical signal into a transmitted optical signal and a reflected optical signal to be directed to a receiving optoelectronic component for measuring power of the reflected optical signal.

Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

Abstract: An active optical cable connector plug includes: an electrical interface configured to connect to a first electronic device; an optical interface configured to connect to an optical cable, the optical cable being configured to connect to a second electronic device; an electrical-to-optical circuitry being connected with the electrical interface and the optical interface and configured to convert a received electrical signal to an optical signal; an optical-to-electrical circuitry being connected with the electrical interface and the optical interface and configured to convert a received optical signal to an electrical signal; a plug-in detection block being connected to the electrical interface and configured to detect the electrical properties of the first electronic device; a plug-in emulation block being connected to the electrical interface and configured to emulate the electrical properties of the second electronic device.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Abstract: A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.

Abstract: An optical finger navigation module includes a light source configured for emitting light in a first spectrum; a cover housing disposed above the light source, the cover housing including a window plate that is configured to transmit light in at least the first spectrum, and a light guiding structure that is configured to transmit light in at least a second spectrum; a first light sensor configured to sense light in the first spectrum originally emitted by the light source, reflected by an object, and then transmitted through the window plate; a second light sensor configured to sense light in the second spectrum transmitted through the light guiding structure or the window plate; and a substrate. The light source, the cover housing, the first light sensor and the second light sensor are coupled and mounted to the substrate.

Abstract: An optoelectronic assembly includes a substrate subassembly and a cable subassembly. The substrate assembly includes a substrate, a holder disposed on the substrate, an optoelectronic interface IC, and a plurality of optoelectronic components. The cable subassembly includes a lens cover and a plurality of fiber cables bonded to the lens cover. The optoelectronic interface IC and the optoelectronic components are disposed in a cavity formed by side walls of the holder. The optoelectronic components include at least one laser source and a plurality of photodiodes. The lens cover is inserted into the cavity and thereby fixedly engaged with the holder.

Abstract: A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system.

Abstract: An active optical connector using an audio port includes a plug insertable into a jack having an optical transceiver module. A conductor is mounted on the plug. Optical fibers extend through a central bore of the plug and have front ends held in a fiber ferrule. The jack has a terminal for contacting the conductor on the plug. The optical transceiver module has a receptacle for receiving the fiber ferrule. A light source emits light to an optical fiber, and a photo-detector receives light from another optical fiber. A controller chip has a converting circuit configured to convert electrical signals into optical signal and optical signals into electrical signals.

Abstract: An optical finger navigation module includes a light source configured for emitting light in a first spectrum; a cover housing disposed above the light source, the cover housing including a window plate that is configured to transmit light in at least the first spectrum, and a light guiding structure that is configured to transmit light in at least a second spectrum; a first light sensor configured to sense light in the first spectrum originally emitted by the light source, reflected by an object, and then transmitted through the window plate; a second light sensor configured to sense light in the second spectrum transmitted through the light guiding structure or the window plate; and a substrate. The light source, the cover housing, the first light sensor and the second light sensor are coupled and mounted to the substrate.

Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Abstract: An optoelectronic assembly includes a substrate subassembly and a cable subassembly. The substrate assembly includes a substrate, a holder disposed on the substrate, an optoelectronic interface IC, and a plurality of optoelectronic components. The cable subassembly includes a lens cover and a plurality of fiber cables bonded to the lens cover. The optoelectronic interface IC and the optoelectronic components are disposed in a cavity formed by side walls of the holder. The optoelectronic components include at least one laser source and a plurality of photodiodes. The lens cover is inserted into the cavity and thereby fixedly engaged with the holder.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.