Patents by Inventor Vincent Wen

Vincent Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6787276
    Abstract: Charge transport layers comprise a charge transport compound and binder including styrene-acrylic resin. Dual layer photoconductors comprise a substrate, a charge transport layer as described, and a charge generation layer.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: September 7, 2004
    Assignee: Lexmark International, Inc.
    Inventors: David Glenn Black, Ronald Harold Levin, Dat Quoc Nguyen, Bradford Lee Taylor, Vincent Wen-Hwa Ting, Franklin Dilworth Zartman
  • Publication number: 20040148571
    Abstract: A method is disclosed to generate, while preserving text, image, transactional and embedded presentation constraint information, a minimum set of simplified and navigable web contents from a single web document that is oversized for targeted smaller devices. The method includes a parser, a content tree builder, a document tree builder, a document simplifier, a virtual layout engine, a document partitioner, a content scalar and a markup generator. The parser generates markup and data tags from an HTML source document. The builder constructs a content tree. The simplifier transforms the document tree into an intermediate one defined by a subset of XHTML tags and attributes. Layout constraints, including size, area, placement order, and column/row relationships, are calculated for partitioning and scaling the document tree into sub document trees with assigned navigation order and hierarchical hyperlinks. A simplified HTML document is then generated with the markup generator.
    Type: Application
    Filed: January 14, 2004
    Publication date: July 29, 2004
    Inventor: Vincent Wen-Jeng Lue
  • Patent number: 6713526
    Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: March 30, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin
  • Publication number: 20040058614
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Application
    Filed: July 24, 2003
    Publication date: March 25, 2004
    Applicant: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Publication number: 20030235770
    Abstract: Charge transport layers comprise a charge transport compound and binder including styrene-acrylic resin. Dual layer photoconductors comprise a substrate, a charge transport layer as described, and a charge generation layer.
    Type: Application
    Filed: June 20, 2002
    Publication date: December 25, 2003
    Inventors: David Glenn Black, Ronald Harold Levin, Dat Quoc Nguyen, Bradford Lee Taylor, Vincent Wen-Hwa Ting, Franklin Dilworth Zartman
  • Patent number: 6627363
    Abstract: The present invention relates to a method of removing halos resulting from focused ion beam (FIB) repair of clear defects on reticles. The halos are formed during carbon deposition on clear defects. An exposure with 172 nm VUV radiation is used to vaporize the carbon compounds in the halo. MSM measurements of the space width adjacent to the repair site are compared to space widths between similar features in areas that are clear of halos. The radiation and measurement is repeated until the % variation between said space widths is <2%. Cleaning and MSM measurement steps are repeated until space width adjacent to the repair site is within 2% of space width in unaffected areas. This method avoids expensive rework and restores transmission through the substrate adjacent to the repair site to a value equivalent to regions of substrate unaffected by halos.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: September 30, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Vincent Wen, Tung-Yaw Kang, Chih-Sheng Chen, Jun-Hsien Chiou, Tsun-Cheng Tang
  • Patent number: 6616887
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: September 9, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Publication number: 20020102411
    Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
    Type: Application
    Filed: January 24, 2002
    Publication date: August 1, 2002
    Applicant: 3M Innovative Properties Company
    Inventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin
  • Patent number: 6403273
    Abstract: Toner particulates comprise a styrene/acrylic copolymer having a first aliphatic hydrocarbon wax incorporated therein during polyermization of the copolymer, and a second aliphatic hydrocarbon wax mixed with the copolymer.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: June 11, 2002
    Assignee: Lexmark International, Inc.
    Inventors: Vincent Wen-Hwa Ting, Michael Thomas Moore
  • Publication number: 20020038916
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 4, 2002
    Applicant: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Patent number: 6352763
    Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: March 5, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin, Timothy Lee Hoopman, Paul Edward Humpal
  • Patent number: 6331372
    Abstract: Toner particulates include a first resin comprising a cross-linked copolymer; a second resin comprising a non-cross-linked copolymer; and a wax comprising an ethylene propylene copolymer. The cross-linked copolymer is a copolymer other than the wax comprising an ethylene propylene copolymer and the non-cross-linked polymer is a copolymer other than the wax comprising an ethylene propylene copolymer.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: December 18, 2001
    Assignee: Lexmark International, Inc.
    Inventors: Bryan Patrick Livengood, James Craig Minor, Michael Thomas Moore, John Melvin Olson, Minerva Piffarerio, Vincent Wen-Hwa Ting
  • Patent number: 6325610
    Abstract: An apparatus for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: December 4, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Publication number: 20010007682
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Application
    Filed: February 8, 2001
    Publication date: July 12, 2001
    Applicant: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Patent number: 6247986
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: June 19, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Parul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Patent number: 4065587
    Abstract: Polyether-urethane polymers, prepared from the reaction of specific molar ratios of diisocyanates with specific mixtures of polyetherdiols, glycols, triols and tetraols, and having 4-10 reactive isocyanate groups are further reacted with hydroxyalkyl acrylates through the free isocyanate functionality to provide polymers having from about 4-10 acrylates units per each mole unit of polyurethane chain. Such polymers when crosslinked under ultraviolet radiation in the presence of photosensitizers, specific reactive monofunctional acrylate solvents and multifunctional acrylate cross-linking agents cure without air inhibition to yield superior "wet look" finishes especially useful for coating metal, wood and floor tile.
    Type: Grant
    Filed: May 11, 1976
    Date of Patent: December 27, 1977
    Assignee: SCM Corporation
    Inventor: Vincent Wen-Hwa Ting