Abstract: A feeding device for feeding wafer strip blanks to pour molds for producing coated wafer biscuits, in particular in multiple coated wafer biscuit production systems, comprising a feeding unit for wafer strips cut from an original wafer board, which feeding unit is composed of a plurality of reeds provided with means for picking up the cut wafer strips and linked to one another by means of pin elements and arranged to be movable with an accordion-like type of movement on a guiding and supporting member to reciprocate between a station where the original wafer board is cut into individual wafer strips and a station where the system pour molds are loaded into which the individual wafer strips are allowed to fall into respective seats provided in the molds. The feeding unit, in its closed position or position where the reeds lay close beside one another, has the same length as the original wafer board, and in its open position, the same length as the pour mold between the end seats of said mold.

Abstract: An apparatus for automatically cutting and feeding wafer biscuits and like products, which apparatus comprises a stationary chute above and sloping toward a conveyor, a hopper at the upper end of the chute for receiving a stack of wafer slabs and delivering them to the conveyor, a pusher for pushing the lowermost wafer through a lower front side opening of the hopper which faces the chute, stationary cutting blades for cutting the wafer slabs into strips as they are pushed out of the hopper, with wafer strips being intermittently advanced between the cutting blades and the lower end of the chute, the intermittent advance of the strips being in synchronism with the movement of the molds and with the pushing of the strips to the cutting blades.