Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract: An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract: An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.

Abstract: A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

Abstract: A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.