Patents by Inventor Vinh T. Nguyen
Vinh T. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230194321Abstract: A flow sensor includes a flow tube in a form of a tube and a support cast around the flow tube. The support clamps the flow tube and the flow tube extends through the support. The flow sensor is formed by placing the flow tube in a tube cavity of a casting mold and pouring or injecting a liquid resin into a support cavity of the casting mold. The support is formed around the flow tube from solidifying the liquid resin in the support cavity of the casting mold. A temperature of the casting mold during formation of the support does not exceed a threshold temperature to avoid deformation of the flow tube. The flow sensor can also include at least one memory chip that stores calibration information associated with the flow sensor and connectors that allows a controller to read the calibration information from the memory chip.Type: ApplicationFiled: February 13, 2023Publication date: June 22, 2023Inventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Patent number: 11585687Abstract: A flow sensor includes a flow tube in a form of a tube and a support cast around the flow tube. The support clamps the flow tube and the flow tube extends through the support. The flow sensor is formed by placing the flow tube in a tube cavity of a casting mold and pouring or injecting a liquid resin into a support cavity of the casting mold. The support is formed around the flow tube from solidifying the liquid resin in the support cavity of the casting mold. A temperature of the casting mold during formation of the support does not exceed a threshold temperature to avoid deformation of the flow tube. The flow sensor can also include at least one memory chip that stores calibration information associated with the flow sensor and connectors that allows a controller to read the calibration information from the memory chip.Type: GrantFiled: April 1, 2020Date of Patent: February 21, 2023Assignee: Malema Engineering CorporationInventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Publication number: 20220214200Abstract: A flow measurement system includes two or more flow sensors that may operate simultaneously and a plurality of connected flow paths for flow of fluids. Each flow sensor is positioned along a different flow path of the plurality of connected flow paths and includes at least one flow tube and a support that clamps the flow tube. The flow tube of each flow sensor has a different resonant frequency so that cross-talk between the flow sensors can be reduced or eliminated. In some embodiments, the flow tube of each flow sensor has a different tube length, wall thickness, material, and/or weight. The flow measurement system can also include one or more pumps for pumping fluid into the flow sensors and a dampener arranged between a pump and a corresponding flow sensor for mitigating interference on the flow sensor from operation of the pump.Type: ApplicationFiled: March 23, 2022Publication date: July 7, 2022Inventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Patent number: 11300435Abstract: A flow measurement system includes two or more flow sensors that may operate simultaneously and a plurality of connected flow paths for flow of fluids. Each flow sensor is positioned along a different flow path of the plurality of connected flow paths and includes at least one flow tube and a support that clamps the flow tube. The flow tube of each flow sensor has a different resonant frequency so that cross-talk between the flow sensors can be reduced or eliminated. In some embodiments, the flow tube of each flow sensor has a different tube length, wall thickness, material, and/or weight. The flow measurement system can also include one or more pumps for pumping fluid into the flow sensors and a dampener arranged between a pump and a corresponding flow sensor for mitigating interference on the flow sensor from operation of the pump.Type: GrantFiled: April 10, 2020Date of Patent: April 12, 2022Assignee: Malema Engineering CorporationInventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Publication number: 20210318154Abstract: A flow measurement system includes two or more flow sensors that may operate simultaneously and a plurality of connected flow paths for flow of fluids. Each flow sensor is positioned along a different flow path of the plurality of connected flow paths and includes at least one flow tube and a support that clamps the flow tube. The flow tube of each flow sensor has a different resonant frequency so that cross-talk between the flow sensors can be reduced or eliminated. In some embodiments, the flow tube of each flow sensor has a different tube length, wall thickness, material, and/or weight. The flow measurement system can also include one or more pumps for pumping fluid into the flow sensors and a dampener arranged between a pump and a corresponding flow sensor for mitigating interference on the flow sensor from operation of the pump.Type: ApplicationFiled: April 10, 2020Publication date: October 14, 2021Inventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Publication number: 20200319006Abstract: A flow sensor includes a flow tube in a form of a tube and a support cast around the flow tube. The support clamps the flow tube and the flow tube extends through the support. The flow sensor is formed by placing the flow tube in a tube cavity of a casting mold and pouring or injecting a liquid resin into a support cavity of the casting mold. The support is formed around the flow tube from solidifying the liquid resin in the support cavity of the casting mold. A temperature of the casting mold during formation of the support does not exceed a threshold temperature to avoid deformation of the flow tube. The flow sensor can also include at least one memory chip that stores calibration information associated with the flow sensor and connectors that allows a controller to read the calibration information from the memory chip.Type: ApplicationFiled: April 1, 2020Publication date: October 8, 2020Inventors: Deepak Bhagwan Malani, Jayasekar Rajagopalan, Claus Waldersdorff Knudsen, Peter Anthony McCann, Vinh T. Nguyen
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Multifunctional modular system for sensing and utilizing corporal dynamics and impact related forces
Patent number: 9460604Abstract: A sensor module that includes an outer casing configured to be removably inserted into a receptacle in an article of wear or sports equipment, a processor positioned within the outer casing, an accelerometer connected to the processor, a communications module connected to the processor, a proximity sensor connected to the processor, an identifier sensor connected to the processor, wherein the identifier sensor is configured to read an identifier connected to or embedded in an article of wear or sports equipment, and an alert module connected to the processor.Type: GrantFiled: June 24, 2013Date of Patent: October 4, 2016Inventors: Isaac S. Daniel, Jon Oswaks, Vinh T. Nguyen, Gary D. Amundson, Alberto Interian, III -
Patent number: 8673298Abstract: Compositions of proteins having free thiols, and methods of making and using such compositions, are described.Type: GrantFiled: October 12, 2010Date of Patent: March 18, 2014Assignee: Shire Human Genetic Therapies, Inc.Inventors: Gaozhong Zhu, Vinh T. Nguyen, Kris Lowe, Zahra Shahrokh
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Patent number: 8338712Abstract: A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.Type: GrantFiled: December 15, 2010Date of Patent: December 25, 2012Inventors: Vinh T. Nguyen, Claude A. S. Hamrick
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Publication number: 20110091414Abstract: Compositions of proteins having free thiols, and methods of making and using such compositions, are described.Type: ApplicationFiled: October 12, 2010Publication date: April 21, 2011Inventors: Gaozhong Zhu, Vinh T. Nguyen, Kris Lowe, Zahra Shahrokh
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Publication number: 20110083881Abstract: A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.Type: ApplicationFiled: December 15, 2010Publication date: April 14, 2011Inventors: Vinh T. Nguyen, Claude A.S. Hamrick
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Patent number: 7874065Abstract: A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1st layer of conductive material to form a ground plane, plurality of metallic 1st traces on a 2nd side of the substrate having widths of approximately 25 microns or less, developing 1st ribs of photoresist forming 1st walls rising above upper surface of an adjacent seed layer trace, depositing 1st conductive signal traces having a thickness exceeding 25 microns into channels and over seed layer traces and stripping the ribs to leave 1st conductive traces having a height-to-transverse ratio exceeding 1.Type: GrantFiled: October 31, 2008Date of Patent: January 25, 2011Inventors: Vinh T. Nguyen, Claude A. S. Hamrick
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Patent number: 7833766Abstract: Compositions of proteins having free thiols, and methods of making and using such compositions, are described.Type: GrantFiled: February 6, 2007Date of Patent: November 16, 2010Assignee: Shire Human Genetic Therapies, Inc.Inventors: Gaozhong Zhu, Vinh T. Nguyen, Kris Lowe, Zahra Shahrokh
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Patent number: 7629804Abstract: A wafer probe head assembly for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs formed on a wafer to be tested includes an adapter board and a probe card assembly including a space transformer and a contactor carrying substrate having a substantially planar bottom surface with printed or plated circuit traces formed thereon and a plurality of contactors plated to or photo-lithographically formed on the traces and arranged to simultaneously ohmically engage the contact pads of one or more ICs on a wafer under test. The contactors may include resilient supporting structures attached to or integrated with the signal carrying circuit traces. The probe card assembly may also include one or more substrate layers with the circuit traces and vias formed on and/or within the substrate layers to facilitate connection of the tester to the contactors.Type: GrantFiled: August 3, 2007Date of Patent: December 8, 2009Assignee: Vertical Test Inc.Inventors: Vinh T. Nguyen, Claude A. S. Hamrick
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Publication number: 20090158581Abstract: A process for making a multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces, comprising of providing an insulative substrate having a first side coated with a layer of conductive metal intended to form a ground plane; providing a plurality of seed layer traces of a predetermined width of approximately 25 microns or less separated from each other by a predetermined distance of approximately 25 microns or less on a second side of the insulative substrate, the narrowness of such separation being essentially limited only by characteristics of the photoresist material to be deposited and developed therebetween and to withstand subsequent processing; developing ribs or barriers of photoresist forming vertical walls rising above the spaces separating the seed layer traces and defining valleys or channels thereover; depositing a desired thickness of conductive material over the seed layer traces and in the valleys or channels between the vertical walls; stripping awType: ApplicationFiled: October 31, 2008Publication date: June 25, 2009Inventors: Vinh T. Nguyen, Claude A.S. Hamrick
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Patent number: 6507207Abstract: An improved contact probe pin for wafer probing apparatus including an elongated metal conductor having a connector (or proximal) end, a center or medial section coated with an elastic material, and a contact pad engaging tip end. At least a portion of the center section of the probe pin is coated with a poorly conductive, but highly elastic material so as to enhance its flex characteristics. The coating may uniformly cover a portion of the center section of the probe pin or it may take on a predetermined pattern or shape. The coating may also unevenly cover a portion of the center section of the probe pin. The coating is selected such that it augments or enhances the resiliency of the pin and causes it to have a predetermined stress-strain profile with vertical (or Z-axis) displacement, and thus enables it to have predetermined probe pin tip contact force characteristics.Type: GrantFiled: February 20, 2001Date of Patent: January 14, 2003Inventor: Vinh T. Nguyen
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Publication number: 20020113612Abstract: An improved contact probe pin for wafer probing apparatus including an elongated metal conductor having a connector (or proximal) end, a center or medial section coated with an elastic material, and a contact pad engaging tip end. More specifically, at least a portion of the center section of the probe pin is coated with a poorly conductive, but highly elastic metal so as to enhance the flex characteristics of the probe pin. The coating may uniformly cover a portion of the center section of the probe pin or it may take on a predetermined pattern or shape. The coating may also, in some applications, unevenly cover a portion of the center section of the probe pin. The coating is selected such that it augments or enhances the resiliency of the pin and causes it to have a predetermined stress-strain profile with vertical (or Z-axis) displacement, and thus enables it to have predetermined probe pin tip contact force characteristics.Type: ApplicationFiled: February 20, 2001Publication date: August 22, 2002Inventor: Vinh T. Nguyen
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Patent number: 6022471Abstract: A FCC catalyst having improved coke selectivity and a FCC process for converting hydrocarbon feedstocks to lower boiling products. The catalyst comprises a crystalline aluminosilicate zeolite, gibbsite, rare earth metal compound and a silica matrix prepared from at least one of a silica sol made by an ion-exchange process and an acidic silica sol prepared by mixing sodium silicate, an acid and an aluminum salt of an acid.Type: GrantFiled: October 15, 1996Date of Patent: February 8, 2000Assignee: Exxon Research and Engineering CompanyInventors: William A. Wachter, Vinh T. Nguyen
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Patent number: 5877950Abstract: This invention relates to a device for measuring currents used in a converter (1) powered by a DC power source and equipped with six switches (T1, T2, T3, T4, T5, T6) associated with diodes (D1, D2, D3, D4, D5, D6) and controlled by a control circuit (2) and a microcontroller (3), and equipped with current sensors (Su, Sv, Sw) each located between the switch and the diode associated with a lower channel, and secondly the return conductor to the DC power source supplying "direct" signals (Isu, Isv, Isw) in phase with the currents (Ia, Ib, Ic) output from the converter, characterized by the fact that it includes means (A46, A62) of calculating an "indirect" replacement signal (Iai) equal to the sum of two "direct" signals (-Isu and -Isw) and a second "indirect" replacement signal (Ici) equal to the sum of the two "direct" signals (-Isu and -Isw) and means (Cu, Cw) for switching either a "direct" signal (Isu or Isw) or an "indirect" replacement signal (Iai or Ici) so as to send to the microcontroller (3) two sigType: GrantFiled: September 9, 1997Date of Patent: March 2, 1999Assignee: Schneider Electric SAInventors: Eric Bonsignour, Vinh T. Nguyen Phuoc
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Patent number: 5644205Abstract: An asynchronous motor is supplied with power from an AC line voltage via a variable speed drive including a rectifier bridge connected to the AC line voltage, a DC voltage intermediate circuit including a capacitor and an inverter including switches and connected to the phase windings of the motor. A system for controlling the power supply to the motor includes a device for controlled resumption of motor speed after supply of power to the motor is interrupted.Type: GrantFiled: December 16, 1994Date of Patent: July 1, 1997Assignee: Schneider Electric S.A.Inventors: Vinh T. Nguyen Phuoc, Hubert Cornilleau, Antonio Almeida, Lucien Perrin