Patents by Inventor Vinod C. Shah

Vinod C. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163214
    Abstract: Methods, system, and apparatuses may support end-to-end (E2E) quality of service (QoS) through the use of service layer (SL) sessions. For example, an application can communicate with a targeted device based on application specified schedule, latency, jitter, error rate, throughput, level of security, and cost requirements.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 16, 2024
    Inventors: Dale N. Seed, Michael F. Starsinic, Vinod Kumar Choyi, Quang Ly, Yogendra C. Shah, William Robert Flynn, IV, Shamim Akbar Rahman, Zhuo Chen
  • Publication number: 20240121227
    Abstract: Existing approaches to security within network, for instance oneM2M networks, are limited. For example, content might only be protected while the content is in transit between entities that trust each other. Here, the integrity and the confidentiality of content in an M2M network are protected. Such content may be “at rest,” such that the content is stored at a hosting node. Only authorized entities may store and retrieve the data that is stored at the hosting node, and the data may be protected from a confidentiality perspective and an integrity perspective.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 11, 2024
    Inventors: Vinod Kumar CHOYI, Yogendra C. SHAH, Dale N. SEED, Michael F. STARSINIC, Shamim Akbar Rahman, Quang LY, Zhuo CHEN, William Robert FLYNN, IV
  • Patent number: 11929928
    Abstract: Methods, system, and apparatuses may support end-to-end (E2E) quality of service (QoS) through the use of service layer (SL) sessions. For example, an application can communicate with a targeted device based on application specified schedule, latency, jitter, error rate, throughput, level of security, and cost requirements.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 12, 2024
    Assignee: Convida Wireless, LLC
    Inventors: Dale N. Seed, Michael F. Starsinic, Vinod Kumar Choyi, Quang Ly, Yogendra C. Shah, William Robert Flynn, IV, Shamim Akbar Rahman, Zhuo Chen
  • Patent number: 4336181
    Abstract: This invention relates to an improved, matured, moldable flame resistant, thermosetting polyester resin system which includes two different polyester resin compositions. One of the resins is a relatively fast reactive resin and generally contains a minor amount of isophthalic acid and a second, slower reactive system devoid of such acid. The resin system includes suitable flame retardant or flame extinguishing compounds including antimony trioxide and a halogenated organic compound. Also present are inert filler materials such as reinforcing fibers or inert, inorganic materials.
    Type: Grant
    Filed: May 19, 1980
    Date of Patent: June 22, 1982
    Assignee: The Budd Company
    Inventors: Kenneth A. Iseler, Vinod C. Shah