Patents by Inventor Vinod Kamath
Vinod Kamath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060221578Abstract: A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.Type: ApplicationFiled: March 30, 2005Publication date: October 5, 2006Applicant: International Business Machines CorporationInventors: Jimmy Foster, Michael June, Vinod Kamath, Beth Loebach, Albert Makley, Jason Matteson
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Patent number: 7116555Abstract: An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.Type: GrantFiled: December 29, 2003Date of Patent: October 3, 2006Assignee: International Business Machines CorporationInventors: Vinod Kamath, Beth Frayne Loebach, Albert Vincent Makley
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Publication number: 20060215366Abstract: An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.Type: ApplicationFiled: March 24, 2005Publication date: September 28, 2006Inventors: Vinod Kamath, Albert Makley, Jason Matteson
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Publication number: 20050141194Abstract: An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.Type: ApplicationFiled: December 29, 2003Publication date: June 30, 2005Applicant: International Business Machines CorporationInventors: Vinod Kamath, Beth Loebach, Albert Makley
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Publication number: 20050133907Abstract: An integrated circuit assembly includes an integrated circuit overlying a printed circuit board and a thermal solution interface such as a fan sink or a heat pipe overlying the integrated circuit. The lower surface of the thermal solution interface has a plurality of spacer structures to enforce a uniform displacement between the lower surface and an underlying surface contacted by the spacers. A heat transfer material, such as a thermal phase change material or a thermal grease, is positioned between the thermal solution interface and the underlying surface contacted by the spacers. The assembly may include a socket connected to the printed circuit board into which the integrated circuit is inserted. The spacers likely enforce a uniform displacement in the range of approximately 0.001 to 0.005 inches. The spacers may be configured as a set of substantially hemispherical protrusions or a set of substantially parallel elongated ridge protrusions.Type: ApplicationFiled: December 23, 2003Publication date: June 23, 2005Inventors: Thomas Hildner, Vinod Kamath
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Patent number: 6856921Abstract: A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.Type: GrantFiled: December 10, 2003Date of Patent: February 15, 2005Assignee: International Business Machines CorporationInventors: Mark E. Cohen, Joseph Anthony Ho-Lung, Vinod Kamath, Leo Harold Webster, Jr., Tin-Lup Wong
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Patent number: 6817405Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.Type: GrantFiled: June 3, 2002Date of Patent: November 16, 2004Assignee: International Business Machines CorporationInventors: Vinod Kamath, Beth Frayne Loebach, Jason Aaron Matteson, Mohanlal S. Mansuria
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Publication number: 20040122606Abstract: A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.Type: ApplicationFiled: December 10, 2003Publication date: June 24, 2004Applicant: International Business Machines CorporationInventors: Mark E. Cohen, Joseph Anthony Ho-Lung, Vinod Kamath, Leo Harold Webster,, Tin-Lup Wong
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Publication number: 20030221814Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.Type: ApplicationFiled: June 3, 2002Publication date: December 4, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vinod Kamath, Beth Frayne Loebach, Jason Aaron Matteson, Mohanlal S. Mansuria
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Publication number: 20020122298Abstract: A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.Type: ApplicationFiled: January 25, 2002Publication date: September 5, 2002Inventors: Mark E. Cohen, Joseph Anthony Ho-Lung, Vinod Kamath, Leo Harold Webster, Tin-Lup Wong
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Patent number: 6445580Abstract: A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.Type: GrantFiled: June 9, 2000Date of Patent: September 3, 2002Assignee: International Business Machines CorporationInventors: Mark E. Cohen, Joseph Anthony Ho-lung, Vinod Kamath, Leo Harold Webster, Jr., Tin-Lup Wong
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Patent number: 6227516Abstract: A mounting tray for a hard disk drive has a base, a front wall, and a pair of side walls. A pair of latching mechanisms are located in each side wall. Each latching mechanism has a slide and a spring-like fastener. The fasteners have an unlocked position where they are biased away from the tray, and a locked position where the slides capture them against the side walls. A tapered pin extends inward from each fastener. With the latching mechanisms in their unlocked positions, a drive is placed in the tray. The slides are then moved to the locked positions such that the pins on the fasteners engage holes in the drive. The pins secure the drive from movement relative to the tray to facilitate hot plugging of the drive into a computer system.Type: GrantFiled: July 28, 1999Date of Patent: May 8, 2001Assignee: International Business Machines CorporationInventors: Leo H. Webster, Jr., Mohanlal Savji Mansuria, Vinod Kamath
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Patent number: 6172871Abstract: A portable data processing system and method are disclosed for improving cooling of a microprocessor included within the system. The portable data processing system includes a base housing for housing a CPU and a display housing for housing a display. A heat sink is established within the base housing. The heat sink is formed from a highly conductive composite material. A heat dissipater is established within the display housing. The heat dissipater is comprised of a highly conductive composite material. The heat dissipater and heat sink are capable of receiving a heat pipe. Heat is transferred from the heat sink to the heat dissipator utilizing the heat pipe. In a second embodiment, the portable system is docked with a docking station, and a heat probe is included which is utilized to dissipate additional heat from the microprocessor to a large fan sink included within the docking station.Type: GrantFiled: March 31, 1999Date of Patent: January 9, 2001Assignee: International Business Machines CorporationInventors: Joseph Anthony Holung, Vinod Kamath, Mohanlal Savji Mansuria, Tin-Lup Wong
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Patent number: 6141216Abstract: A notebook computer has a base and a cover that is pivotally mounted to the base with a hinge. An integrated circuit chip is mounted to the base and has one end of a heat pipe attached to it or to an associated heat dissipation device. The other end of the heat pipe lies along the hinge. A spreader plate is mounted in the cover and attached to the other end of the heat pipe to form a nested, rotational joint. One end of the plate is located along the hinge and formed into a slotted cylinder. The heat pipe is pressed into the slot to form the joint which is tight around the heat pipe, but still allows it to rotate to accommodate the pivot motion of the cover. A retainer may be incorporated into the design to further enhance the strength of the joint and assure thermal continuity. The retainer is a hollow cylinder with an axial slit through which the plate extends.Type: GrantFiled: March 31, 1999Date of Patent: October 31, 2000Assignee: International Business Machines CorporationInventors: Joseph Anthony Holung, Tin-Lup Wong, Vinod Kamath
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Patent number: 6031716Abstract: An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, the arrangement is employed for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard housing having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and containing heat-generating computer electronics, from which heat is removed through the intermediary of heat pipes which are hingedly connected with at least one heat dissipator located in the display unit.Type: GrantFiled: September 8, 1998Date of Patent: February 29, 2000Assignee: International Business Machines CorporationInventors: Thomas Mario Cipolla, Joseph Anthony Holung, Vinod Kamath, Mohanlal Savji Mansuria, Lawrence Shungwei Mok, Tin-Lup Wong
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Patent number: 5794687Abstract: An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.Type: GrantFiled: August 4, 1997Date of Patent: August 18, 1998Assignee: International Business Machine Corp.Inventors: Leo H. Webster, Jr., Lawrence Shungwei Mok, Vinod Kamath, Mohanlal S. Mansuria