Patents by Inventor Vinski Bräysy
Vinski Bräysy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950367Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: July 17, 2023Date of Patent: April 2, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Patent number: 11914184Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: June 22, 2023Date of Patent: February 27, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11906774Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: May 31, 2023Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11910530Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: March 25, 2022Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Publication number: 20240021764Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004120Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004119Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: ApplicationFiled: May 31, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240003516Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20230389184Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and the second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: July 17, 2023Publication date: November 30, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Patent number: 11817534Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: GrantFiled: July 2, 2022Date of Patent: November 14, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Sami Torvinen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Publication number: 20230309231Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: March 25, 2022Publication date: September 28, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Patent number: 11703627Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: September 15, 2022Date of Patent: July 18, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11530808Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: August 17, 2022Date of Patent: December 20, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Korhonen
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Patent number: 11500142Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: July 2, 2022Date of Patent: November 15, 2022Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11460185Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: March 25, 2022Date of Patent: October 4, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Koronen
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Patent number: 11461609Abstract: The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.Type: GrantFiled: March 25, 2022Date of Patent: October 4, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Mikko Heikkinen, Mikko Sippari, Pälvi Apilo, Ilpo Hänninen, Samuli Yrjänä, Pasi Korhonen, Taneli Salmi
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Patent number: 11385399Abstract: An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.Type: GrantFiled: March 25, 2022Date of Patent: July 12, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Jarmo Sääski, Mikko Heikkinen, Ilpo Hänninen, Pasi Korhonen, Giovanni Ferri
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Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10960641Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: GrantFiled: October 2, 2020Date of Patent: March 30, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10946612Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.Type: GrantFiled: August 27, 2018Date of Patent: March 16, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF
Publication number: 20210016539Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: ApplicationFiled: October 2, 2020Publication date: January 21, 2021Inventors: Vinski BRÄYSY, Anne ISOHÄTÄLÄ, Jarmo SÄÄSKI, Tomi SIMULA