Abstract: The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

Abstract: The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

Abstract: A multifunctional multichip system can operate in a passive mode by using at least one antenna to receive electromagnetic energy and using that energy to perform system functions. The system includes a sensor, an impedance matching circuit and an RFID module. The sensor produces a sensor signal containing a measurement. The RFID can produce an identification signal containing identification information. Alternatively, the RFID chip can be used in an addressing mode wherein the system only produces a signal in response to an addressing signal containing addressing information. The addressing signal is received from the electromagnetic field. In either mode, the sensor signal is coupled from the antenna into the electromagnetic field from which a receiver can obtain it. The signal can contain the identification information as well as the measurement. A matching network minimizes the effects of impedance mismatches between the system elements.

Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.