Abstract: A method for fabricating polysilicon of reduced resistance that may be incorporated in silicon integrated chip manufacturing processes which comprises coating a wafer bearing dielectrically isolated islands with an isolating layer, and depositing thereover a layer of polysilicon. On the surface of the polysilicon layer, a masking layer is formed, and coated with a metallic reflective layer. The portion of the reflective layer, and, optionally, the masking layer, overlaying the interisland area is removed, and the wafer is then exposed to a laser beam, transforming the polysilicon layer into the appropriate resistor material. The remaining metallic and/or masking layer may then be removed, the device exposed to a laser beam again, thereby transforming the polysilicon across the entire surface.

Abstract: A method for fabricating polysilicon of reduced resistance that may be incorporated in silicon integrated chip manufacturing processes which comprises coating a wafer bearing dielectrically isolated islands with an isolating layer, and depositing thereover a layer of polysilicon. On the surface of the polysilicon layer, a masking layer is formed, and coated with a metallic reflective layer. The portion of the reflective layer, and, optionally, the masking layer, overlaying the interisland area is removed, and the wafer is then exposed to a laser beam, transforming the polysilicon layer into the appropriate resistor material. The remaining metallic and/or masking layer may then be removed, the device exposed to a laser beam again, thereby transforming the polysilicon across the entire surface.

Abstract: A residual crystallization retardation layer is provided between the non-crystalline switchable semiconductor layer and each electrode structure. Amorphous germanium, silicon or carbon form good crystallization retardation layers and also minimize electromigration and reduce solubility of tellurium in the electrodes.

Abstract: A first voltage pulse is applied having sufficient amplitude to switch the device from a high to a low resistance state and subsequently maintaining a holding current. A second voltage pulse is applied after the device has switched to drive the filamentous path into the liquid phase for a short duration.