Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate having a top surface and a vertical surface extending downward from the top surface. The top surface and the vertical surface can define an edge. The electronic device package can also include an electronic component disposed on the top surface of the substrate and electrically coupled to the substrate. In addition, the electronic device package can include an underfill material disposed at least partially between the electronic component and the top surface of the substrate. A lateral portion of the underfill material can extend from the electronic component to at least the edge. Associated systems and methods are also disclosed.

Abstract: An electronic package assembly is disclosed. A substrate can have an upper surface area. A first active die can have an upper surface area and a bottom surface, the bottom surface operably coupled to the substrate. A second active die can have an upper surface area and a bottom surface, the bottom surface operably coupled to the substrate. A capillary underfill material can at least partially encapsulate the bottom surface of the first active die and the second active die and extend upwardly upon inside side surfaces of the first and second active dies. A combined area of the upper surface area of the first active die and an upper surface area of the second active die is at least about 90% of the upper surface area of the substrate.

Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.

Abstract: Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate having a top surface and a vertical surface extending downward from the top surface. The top surface and the vertical surface can define an edge. The electronic device package can also include an electronic component disposed on the top surface of the substrate and electrically coupled to the substrate. In addition, the electronic device package can include an underfill material disposed at least partially between the electronic component and the top surface of the substrate. A lateral portion of the underfill material can extend from the electronic component to at least the edge. Associated systems and methods are also disclosed.

Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.

Abstract: An electronic package assembly is disclosed. A substrate can have an upper surface area. A first active die can have an upper surface area and a bottom surface, the bottom surface operably coupled to the substrate. A second active die can have an upper surface area and a bottom surface, the bottom surface operably coupled to the substrate. A capillary underfill material can at least partially encapsulate the bottom surface of the first active die and the second active die and extend upwardly upon inside side surfaces of the first and second active dies. A combined area of the upper surface area of the first active die and an upper surface area of the second active die is at least about 90% of the upper surface area of the substrate.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for surface treatment of an integrated circuit (IC) substrate. In one embodiment, an apparatus includes an integrated circuit substrate, an interconnect structure disposed on the integrated circuit substrate, the interconnect structure being configured to route electrical signals to or from the integrated circuit substrate and comprising a metal surface, and a protective layer disposed on the metal surface of the interconnect structure, the protective layer comprising a first functional group bonded with the metal surface and a second functional group bonded with the first functional group, wherein the second functional group is hydrophobic to inhibit contamination of the metal surface by hydrophilic materials and further inhibits oxidation of the metal surface. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for surface treatment of an integrated circuit (IC) substrate. In one embodiment, an apparatus includes an integrated circuit substrate, an interconnect structure disposed on the integrated circuit substrate, the interconnect structure being configured to route electrical signals to or from the integrated circuit substrate and comprising a metal surface, and a protective layer disposed on the metal surface of the interconnect structure, the protective layer comprising a first functional group bonded with the metal surface and a second functional group bonded with the first functional group, wherein the second functional group is hydrophobic to inhibit contamination of the metal surface by hydrophilic materials and further inhibits oxidation of the metal surface. Other embodiments may be described and/or claimed.