Abstract: Methods and apparatus for sensor including a die, a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface, lead fingers to provide electrical connections to the leadframe and to the die; and a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package. The leadframe may have a cutout region in which the component is positioned.

Abstract: An optical encoder system includes: a light emitter configured to emit a light flux; a plurality of photodetectors in an array, wherein each photodetector is operable to generate a current in response to the light flux; and a target object positioned to reflect the light flux onto the plurality of photodetectors; wherein the light emitter is configured to produce a non-circular pattern of the light flux.

Abstract: Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.

Abstract: Methods and apparatus for a sensor having a die supporting a magnetic field sensor element, a leadframe having opposed first and second surfaces and leadfingers, a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package, and a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.

Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Methods and apparatus provide a sensor including a component coupled to the leadframe such that the component is an integrated part of the IC package.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.

Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.

Abstract: Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.

Abstract: An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.

Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.

Abstract: A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper semiconductor die. The pillar is formed integrally with and of the same material as the leadframe, and is sized to have a predetermined height that is higher than the height of such a lower semiconductor die plus the height of bonding wires for such a lower semiconductor die plus a predetermined spacing between such bonding wires and the bottom of an upper semiconductor die to be supported on the at least one pillar.

Abstract: An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.

Abstract: An electronic device having a substrate carrier is provided. A semiconductor connected to the substrate carrier. A heat spreader having upper and lower surfaces and legs recessed below the lower surface is connected to the substrate carrier. The Z-dimension between the heat spreader and the substrate carrier is maintained over substantially the entire area of the substrate carrier.