Abstract: A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

Abstract: A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.

Abstract: A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.

Abstract: A microelectromechanical (MEMS) device is fabricated from a wafer having a plurality of die regions with grooves and MEMS components formed on a wafer surface at each die region. A first metal having a relatively high melting temperature is formed on sidewalls of each groove, and a cap is attached at each die region to provide a closed cavity which encloses the grooves and MEMS components. Bottoms of the grooves are opened by thinning the wafer thereby establishing through-hole vias extending through the wafer at each die region, for accessing the cavity for inserting or removing material. The vias are sealed by interacting a second metal having a relatively low melting temperature with the first metal layer to form intermetallic compounds with higher melting temperature that maintain the seal during subsequent lower temperature operations.

Abstract: A microelectromechanical (MEMS) device is fabricated from a wafer having a plurality of die regions with grooves and MEMS components formed on a wafer surface at each die region. A first metal having a relatively high melting temperature is formed on sidewalls of each groove, and a cap is attached at each die region to provide a closed cavity which encloses the grooves and MEMS components. Bottoms of the grooves are opened by thinning the wafer thereby establishing through-hole vias extending through the wafer at each die region, for accessing the cavity for inserting or removing material. The vias are sealed by interacting a second metal having a relatively low melting temperature with the first metal layer to form intermetallic compounds with higher melting temperature that maintain the seal during subsequent lower temperature operations.

Abstract: A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

Abstract: An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.

Abstract: A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.

Abstract: A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.