Abstract: A semiconductor wafer (10) and associated methods are disclosed in which a plurality of semiconductor dice (14) include a semiconductor substrate (12) overlain by a plurality of upper layers (13) are provided with encompassing scribe streets (20) at the top surface (16) of the wafer (10) defined by inactive areas (18) between and circumscribing the dice (14). Ditches (22) in the scribe streets (20) extend from the top surface (16) to the substrate (12) for facilitating saw singulation of the dice (14).