Patents by Inventor Vishal Javvaji

Vishal Javvaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230108000
    Abstract: An integrated circuit structure comprises one or more first level interconnects (FLIs) embedded in an underfill (UF) over a substrate. An etch stop layer is over the FLIs. A passivation layer is over the etch stop layer and a plurality of vias are through the passivation layer. A plurality of contacts are on the passivation layer in contact with the vias to connect with the FLI. A plurality of topological crack stop (TCS) features are formed in the passivation layer and on a top surface of the etch stop layer.
    Type: Application
    Filed: September 24, 2021
    Publication date: April 6, 2023
    Inventors: Vishal JAVVAJI, Christopher M. PELTO, Dimitrios ANTARTIS, Digvijay A. RAORANE, Michael P. O'DAY, Seung-June CHOI
  • Publication number: 20200105669
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes back end layers that include a first metallization layer, a second metallization layer, and a scalable resistor between the first metallization layer and the second metallization layer. The semiconductor structure also includes front end layers.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Sagar SUTHRAM, Seung-June CHOI, Vishal JAVVAJI, Soumya KAR, Ahmed ESMAIL, Gokul MALYAVANATHAM
  • Patent number: 8858883
    Abstract: A biosensor comprising an electrically conductive substrate coated with a modified chitosan biopolymer that has been electrodeposited on the substrate, wherein said modified chitosan biopolymer comprises at least one vesicle binding molecule. The biosensor is manufactured by a method where a modified chitosan biopolymer is electrodeposited on a substrate. The method is also used to manufacture a modified chitosan biopolymer film by electrodeposition of the chitosan on the substrate and later removing the film from the substrate after electrodeposition. The resulting film can be used in bandages to treat various types of wounds. The biosensor can also be used to detect various analytes in samples.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: October 14, 2014
    Assignees: University of Maryland, College Park, Wichita State University
    Inventors: Matthew Dowling, Srinivasa R. Raghavan, Neeraja Dashaputre, Douglas Stephen English, Vishal Javvaji, Gregory F. Payne, Philip R. DeShong
  • Publication number: 20120252703
    Abstract: A biosensor comprising an electrically conductive substrate coated with a modified chitosan biopolymer that has been electrodeposited on the substrate, wherein said modified chitosan biopolymer comprises at least one vesicle binding molecule. The biosensor is manufactured by a method where a modified chitosan biopolymer is electrodeposited on a substrate. The method is also used to manufacture a modified chitosan biopolymer film by electrodeposition of the chitosan on the substrate and later removing the film from the substrate after electrodeposition. The resulting film can be used in bandages to treat various types of wounds. The biosensor can also be used to detect various analytes in samples.
    Type: Application
    Filed: December 2, 2011
    Publication date: October 4, 2012
    Applicant: University of Maryland,College Park Office of Technology and Commercialization
    Inventors: Matthew Dowling, Srinivasa R. Raghavan, Neeraja Dashaputre, Douglas Stephen English, Vishal Javvaji, Gregory F. Payne, Philip R. DeShong