Patents by Inventor Vishal Shajan

Vishal Shajan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric filler material in conductive material that functions as fiducial for an electronic device
    Patent number: 11527484
    Abstract: An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: December 13, 2022
    Assignee: Intel Corporation
    Inventors: Jesse C. Jones, Gang Duan, Jason Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan
  • DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS FIDUCIAL FOR AN ELECTRONIC DEVICE
    Publication number: 20210043580
    Abstract: An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
    Type: Application
    Filed: October 23, 2020
    Publication date: February 11, 2021
    Inventors: Jesse C. JONES, Gang DUAN, Jason GAMBA, Yosuke KANAOKA, Rahul N. MANEPALLI, Vishal SHAJAN
  • Dielectric filler material in conductive material that functions as fiducial for an electronic device
    Patent number: 10847471
    Abstract: An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Jesse C. Jones, Gang Duan, Jason Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan
  • FIDUCIAL FOR AN ELECTRONIC DEVICE
    Publication number: 20200027841
    Abstract: An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 23, 2020
    Inventors: Jesse C. Jones, Gang Duan, Jason Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan