Patents by Inventor Visveswaran Srinivasan

Visveswaran Srinivasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making preforms useful for encapsulating semiconductors
    Patent number: 5804126
    Abstract: Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: September 8, 1998
    Assignee: Amoco Corporation
    Inventors: Palitha Mahendra S. Karunaratne, Visveswaran Srinivasan, Manuel Alameda Chua, Jr., Neep Hing Chin, Nicholas Andrew Rounds