Patents by Inventor Viswamadham Puligandla

Viswamadham Puligandla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies
    Publication number: 20020162679
    Abstract: Surface mount packages having pre-applied underfill thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.
    Type: Application
    Filed: April 29, 2002
    Publication date: November 7, 2002
    Inventors: Nael Hannan, Viswamadham Puligandla, Steven Dunford, Pekka Rautila