Patents by Inventor Viswas Purohit

Viswas Purohit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface modification control for etch metric enhancement
    Patent number: 10446453
    Abstract: A method is disclosed for monitoring and controlling a process of plasma-assisted surface modification of a layer formed on a substrate. The method includes flowing a surface modification gas into a plasma processing chamber of a plasma processing system, igniting a plasma in the plasma processing chamber to initiate a surface modification process for a layer formed on a substrate, and acquiring optical emission spectra from an optical emission spectroscopy system attached to the plasma processing chamber, during the surface modification process for the layer. For one embodiment, the method includes altering at least one parameter of the surface modification process based on the acquired optical emission spectra. For one embodiment, the acquired optical emission spectra can include an intensity of a spectral line, a slope of a spectral line, or both to enable endpoint control of the surface modification process. Additional methods and related systems are also disclosed.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 15, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Brian J. Coppa, Viswas Purohit, Seiichi Watanabe, Kenji Komatsu
  • SURFACE MODIFICATION CONTROL FOR ETCH METRIC ENHANCEMENT
    Publication number: 20180269119
    Abstract: A method is disclosed for monitoring and controlling a process of plasma-assisted surface modification of a layer formed on a substrate. The method includes flowing a surface modification gas into a plasma processing chamber of a plasma processing system, igniting a plasma in the plasma processing chamber to initiate a surface modification process for a layer formed on a substrate, and acquiring optical emission spectra from an optical emission spectroscopy system attached to the plasma processing chamber, during the surface modification process for the layer. For one embodiment, the method includes altering at least one parameter of the surface modification process based on the acquired optical emission spectra. For one embodiment, the acquired optical emission spectra can include an intensity of a spectral line, a slope of a spectral line, or both to enable endpoint control of the surface modification process. Additional methods and related systems are also disclosed.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 20, 2018
    Inventors: Brian J. Coppa, Viswas Purohit