Patents by Inventor Viswas Reddy Pola

Viswas Reddy Pola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL SILICIDE LAYER FOR MEMORY ARRAY
    Publication number: 20230276639
    Abstract: A memory device comprising a memory array comprising a plurality of memory cells and a metal silicide layer, wherein a memory cell is coupled between a first access line and a second access line and comprises an electrode coupling a storage element to the first access line, wherein the metal silicide layer is between the electrode and the first access line.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Applicant: Intel Corporation
    Inventors: Viswas Reddy Pola, Shafaat Ahmed, Gowtham Sriram Jawaharram, Gregory C. Herdt
  • RELIABLE ELECTRODE FOR MEMORY CELLS
    Publication number: 20230209834
    Abstract: A memory device comprising a three dimensional crosspoint memory array comprising a plurality of memory cells, wherein a memory cell is coupled between a first access line and a second access line and comprises an electrode coupled to a storage element, wherein the electrode comprises silicon carbide (SixCy).
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Applicant: Intel Corporation
    Inventors: Shafaat Ahmed, Cyrus M. Fox, Gregory C. Herdt, Gowtham Sriram Jawaharram, Viswas Reddy Pola
  • MULTI-LAYER INTERCONNECT
    Publication number: 20230157035
    Abstract: An apparatus comprising a substrate; and an interconnect comprising a first metal layer between and in contact with a second metal layer and a third metal layer, wherein the first metal layer has a resistivity that is lower than a resistivity of the second metal layer and a resistivity of the third metal layer.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Intel Corporation
    Inventors: Shafaat Ahmed, Viswas Reddy Pola, Gregory C. Herdt