Patents by Inventor Vito Pagliarulo

Vito Pagliarulo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7576996
    Abstract: A telecommunications system comprising: a first printed circuit board associated with a first port, the first printed circuit board having first plated through holes for receiving first insulation displacement contacts associated with a first connecting block and first traces on the first printed circuit board; a second printed circuit board associated with a second port, the second printed circuit board having second plated through holes for receiving second insulation displacement contacts associated with a second connecting block and second traces on the second printed circuit board; wherein one of the first plated through holes, second plated through holes, first traces and second traces is positioned to reduce alien crosstalk between the first port and the second port.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: August 18, 2009
    Assignee: The Siemon Company
    Inventors: Daniel J. Mullin, Brian Celella, Vito Pagliarulo, Mark Navarra, Olindo Savi, Vinicio Crudele, Douglas Bond
  • Patent number: 7361063
    Abstract: A patch panel includes a first outlet having a first connecting block; a second outlet having a second connecting block, the second connecting block positioned adjacent to the first connecting block; a conductive shield positioned between the first connecting block and the second connecting block to reduce alien crosstalk.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: April 22, 2008
    Assignee: The Siemon Company
    Inventors: Daniel J. Mullin, Brian Celella, Vito Pagliarulo, Mark Navarra, Olindo Savi, Vinicio Crudele, Douglas Bond, Michael Weed
  • Publication number: 20070082519
    Abstract: A telecommunications system comprising: a first printed circuit board associated with a first port, the first printed circuit board having first plated through holes for receiving first insulation displacement contacts associated with a first connecting block and first traces on the first printed circuit board; a second printed circuit board associated with a second port, the second printed circuit board having second plated through holes for receiving second insulation displacement contacts associated with a second connecting block and second traces on the second printed circuit board; wherein one of the first plated through holes, second plated through holes, first traces and second traces is positioned to reduce alien crosstalk between the first port and the second port.
    Type: Application
    Filed: October 11, 2006
    Publication date: April 12, 2007
    Inventors: Daniel Mullin, Brian Celella, Vito Pagliarulo, Mark Navarra, Olindo Savi, Vinicio Crudele, Douglas Bond
  • Publication number: 20070082540
    Abstract: A patch panel includes a first outlet having a first connecting block; a second outlet having a second connecting block, the second connecting block positioned adjacent to the first connecting block; a conductive shield positioned between the first connecting block and the second connecting block to reduce alien crosstalk.
    Type: Application
    Filed: October 11, 2006
    Publication date: April 12, 2007
    Inventors: Daniel Mullin, Brian Celella, Vito Pagliarulo, Mark Navarra, Olindo Savi, Vinicio Crudele, Douglas Bond, Michael Weed
  • Patent number: 7154049
    Abstract: A printed circuit board providing crosstalk compensation. The printed circuit board includes first plated through holes for receiving a first connecting component and second plated through holes for receiving a second connecting component. A signal carrying trace transmits a signal from one of the first plated through holes to one of the second plated through holes. A phase delay control trace is in electrical connection with the one of the first plated through holes. The phase delay control trace affects phase delay of the signal from the one of the first plated through holes to the one of the second plated through holes.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: December 26, 2006
    Assignee: The Siemon Company
    Inventors: Brian Celella, Vito Pagliarulo, Daniel Mullin
  • Publication number: 20040147165
    Abstract: A printed circuit board providing crosstalk compensation. The printed circuit board includes first plated through holes for receiving a first connecting component and second plated through holes for receiving a second connecting component. A signal carrying trace transmits a signal from one of the first plated through holes to one of the second plated through holes. A phase delay control trace is in electrical connection with the one of the first plated through holes. The phase delay control trace affects phase delay of the signal from the one of the first plated through holes to the one of the second plated through holes.
    Type: Application
    Filed: November 19, 2003
    Publication date: July 29, 2004
    Inventors: Brian Celella, Vito Pagliarulo, Daniel Mullin