Patents by Inventor Vittorio Sirtori
Vittorio Sirtori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6994803Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.Type: GrantFiled: May 12, 2003Date of Patent: February 7, 2006Assignee: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6815088Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: GrantFiled: July 29, 2003Date of Patent: November 9, 2004Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Flavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20040020566Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: ApplicationFiled: July 29, 2003Publication date: February 5, 2004Applicant: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Flavio Cereda, Franco Zambon, Vittorio Sirtori
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Patent number: 6635123Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: GrantFiled: April 23, 2001Date of Patent: October 21, 2003Assignee: International Business Machines CorporationInventors: Pletro Luigi Cavallotti, Fiavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20030188430Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimetre) of a paste very soluble in water and washing it off.Type: ApplicationFiled: May 12, 2003Publication date: October 9, 2003Applicant: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6574860Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.Type: GrantFiled: September 20, 2000Date of Patent: June 10, 2003Assignee: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6453263Abstract: A method and system for estimating the roughness and the contamination of a surface. A preferred embodiment of the present invention makes use of a mathematical model which gives indications of the metal roughness, expressed as the ratio of metal volume to air volume, and the contamination thickness values of a metal substrate (e.g. gold) for a determined contamination (e.g. organic). This model is based on a series of tables which represent the expected values of &psgr;, i.e. the ratio between the amplitudes of the incident beam on the two polarization planes multiplied by the ratio of the amplitudes of the reflected beam on the polarization planes, and &Dgr;, i.e. the difference between the phases on the two polarization planes of the incident beam and the reflected beam, for a gold substrate having a predetermined roughness and a predetermined type of contamination (organic).Type: GrantFiled: April 13, 2000Date of Patent: September 17, 2002Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Lorenza Lombardi, Michele Monopoli, Franco Zambon
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Publication number: 20010030223Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: ApplicationFiled: April 23, 2001Publication date: October 18, 2001Inventors: Pletro Luigi Cavallotti, Fiavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20010025016Abstract: A water-free solution and method for dissolving and removing thermal grease from a high frequency logic device (e.g. a microprocessor in the form of a BGA and ASIC in the form of Quad Flat Pack component) assembled onto an electronic card which needs to be reworked. The method and solution of the present invention allow the complete removal of the grease by a simple and fast process, using an alcoholic, inert and cheap solution, without needing a mechanical action (e.g. brushing) and without damaging the card components. Furthermore, given the low surface tension of the alcoholic solution a good diffusion within the small holes and spaces of the card is ensured.Type: ApplicationFiled: December 4, 2000Publication date: September 27, 2001Inventors: Paul Joseph Hart, Vittorio Sirtori, Sergio Varinelli, Marino Verderio, Franco Zambon
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Patent number: 6190734Abstract: A method and a bath for protecting a Zn or Zn alloy surface against the corrosion and oxidation and for improving the wettability characteristics of a Zn or Zn alloy surface with a Sn solder alloy. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Zn or Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface.Type: GrantFiled: September 23, 1998Date of Patent: February 20, 2001Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Franco Zambon, Pietro Luigi Cavallotti, Luca Magagnin
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Patent number: 6179927Abstract: A method for decontaminating the copper surfaces (e.g. circuits) of an electronic card from copper salts which can be formed after the soldering of the electronic components onto the substrate employing a water free solution which comprises an alcohol and at least one neutral ammonium salt of an organic acid.Type: GrantFiled: May 30, 2000Date of Patent: January 30, 2001Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Giovanni Cattaneo, Fabio Mauri
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Patent number: 6165278Abstract: A method for removing thermal grease from an electronic card having plated via holes and including electronic components thereon, the method including the steps of providing a substantially water free solution having an alcohol and at least one compound of a neutral ammonium salt of an organic acid and immersing the electronic card in the solution for a predetermined period of time remove the thermal grease from the electronic card.Type: GrantFiled: March 27, 2000Date of Patent: December 26, 2000Assignee: International Business Machines CorporationInventors: Paul Joseph Hart, Vittorio Sirtori, Sergio Varinelli, Marino Verderio, Franco Zambon
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Patent number: 6133213Abstract: A water free solution for decontaminating copper surfaces (e.g. circuits of an electronic card) from copper salts which includes an alcohol and at least one neutral ammonium salt of an organic acid.Type: GrantFiled: July 20, 1999Date of Patent: October 17, 2000Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Giovanni Cattaneo, Fabio Mauri
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Patent number: 6048629Abstract: An electronic device has a layer of high wettability tin-bismuth solder alloy on component leads and substrate pads. The solder is electrodeposited onto copper with an electrodeposition bath containing a zinc salt, although no zinc is co-deposited on the copper. The tin-bismuth layer has a low quantity of oxygen thereby increasing the wettability and decreasing the oxidation at the surface after reflowing.Type: GrantFiled: July 17, 1998Date of Patent: April 11, 2000Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavalloti, Vittorio Sirtori, Giovanni Zangari
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Patent number: 6045604Abstract: A method and a bath for autocatalytic chemical deposition of a Sn Zn alloy on a catalytic surface. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Sn Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface. The Cu surface must be made catalytic before immersion in the autocatalytic bath, e.g. by depositing a thin film of metallic Sn.Type: GrantFiled: September 23, 1998Date of Patent: April 4, 2000Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Vittorio Sirtori
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Patent number: 5863406Abstract: A method of manufacturing a printed circuit board adapted for having surface mounted components positioned thereon including the step of selectively electroplating a thick solder layer (340) onto selected conductive projections (230). The selective electrodeposition is performed by electrolessly applying a conductive layer (310) onto the board (100) previously provided with circuit conductors (220) and conductive projections (230), providing a thick insulating mask (310) leaving exposed the selected conductive projections (230), and electroplating the thick solder layer (340). The method of manufacturing an electronic card by surface mounting of components (SMT) onto the printed circuit board (100) obtainable by the above-described method further includes the step of dispensing a flux, preferably a no-clean flux dispensed by syringe, onto the board (100), avoiding solder paste application or adhesive screening.Type: GrantFiled: May 19, 1997Date of Patent: January 26, 1999Assignee: International Business Machines Corp.Inventors: Roberto Mazzoni, Adelio Monzani, Vittorio Sirtori
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Patent number: 5783059Abstract: An electrodeposition bath for depositing a Sn alloy onto a Cu substrate containing a Zn salt. This bath is particularly useful for Pb free alloy, such as a Sn--Bi alloy. The presence of Zn in the elctrodeposition bath greatly influence the bath behaviour and the characteristics of the deposited alloy, even if no Zn is codeposited on the Cu substrate.Type: GrantFiled: April 22, 1997Date of Patent: July 21, 1998Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Vittorio Sirtori, Giovanni Zangari
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Patent number: 5759379Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).Type: GrantFiled: March 5, 1997Date of Patent: June 2, 1998Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Adelio Monzani, Vittorio Sirtori, Giovanni Zangari
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Patent number: 4212932Abstract: A cell for the direct conversion of radiant energy to electrical energy for arrying the process is characterized in that it comprises two layer-like zones each comprising a transparent material and at least one photochromic compound, electrical conduction means between said two zones, and two electrodes. The two layer-like zones may be constituted by different portions of a same layer. The photochromic compounds used are preferably spiro-2H-pyranes and the electrodes are metals having a standard oxidation potential higher than--2.5V or their oxides or photoactive semi-conductors.Type: GrantFiled: February 22, 1979Date of Patent: July 15, 1980Assignee: Societe' Nazionale Industria Applicazioni Viscosa S.p.A. (Snia Viscosa)Inventors: Seba Calgari, Vittorio Sirtori, Ignazio R. Bellobono