Abstract: A robotic system includes a mobile base assembly and a lifting assembly. The lifting assembly includes wedge blocks, each of which is pivotably connected to a front edge of the mobile base assembly and pivotable along a hinge axis. During an operation of the robotic system, at least a portion of the wedge blocks may be slid under the boxes to lift the boxes.

Abstract: This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.