Patents by Inventor Vivek KOHLI

Vivek KOHLI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11854721
    Abstract: An apparatus includes a strength member including a core formed of a composite material, and an encapsulation layer disposed around the core. A conductor layer is disposed around the strength member. A coating is disposed on the conductor layer. The coating is formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius. The coating may have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: December 26, 2023
    Assignee: TS Conductor Corp.
    Inventors: Jianzhong Jason Huang, Rulong Chen, Jianping Huang, Vivek Kohli
  • Publication number: 20230307155
    Abstract: An apparatus includes a strength member including a core formed of a composite material, and an encapsulation layer disposed around the core. A conductor layer is disposed around the strength member. A coating is disposed on the conductor layer. The coating is formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius. The coating may have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 28, 2023
    Inventors: Jianzhong Jason HUANG, Rulong CHEN, Jianping HUANG, Vivek KOHLI