Patents by Inventor Vivek M. Sura

Vivek M. Sura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Large ceramic article and method of manufacturing
    Patent number: 5541005
    Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
    Type: Grant
    Filed: May 11, 1995
    Date of Patent: July 30, 1996
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz, Katherine G. Frase, David H. Gabriels, Lester W. Herron, John U. Knickerbocker, Sarah H. Knickerbocker, Govindarajan Natarajan, John Thomson, Yee-Ming Ting, Sharon L. Tracy, Robert M. Troncillito, Vivek M. Sura, Donald R. Wall, Giai V. Yen
  • I/O pad adhesion layer for a ceramic substrate
    Patent number: 5532031
    Abstract: A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.
    Type: Grant
    Filed: January 29, 1992
    Date of Patent: July 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Shaji Farooq, Sampath Purushothaman, Srinivasa S. N. Reddy, Vivek M. Sura
  • Module input-output pad having stepped set-back
    Patent number: 5483105
    Abstract: A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped setback in the upper surface thereof which setback is oxidized to prevent wetting by the brazing alloy which bonds the pin to the pad. Stresses attributable to the brazing are isolated from the setback area and thus have reduced effect in causing cracking at the edges of the pad-substrate interface.
    Type: Grant
    Filed: April 25, 1994
    Date of Patent: January 9, 1996
    Assignee: International Business Machines Corporation
    Inventors: Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy, Vivek M. Sura, George E. White
  • Large ceramic articles and method of manufacturing
    Patent number: 5439636
    Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: August 8, 1995
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz, Katharine G. Frase, David H. Gabriels, Lester W. Herron, John U. Knickerbocker, Sara H. Knickerbocker, Govindarajan Natarajan, John Thomson, Yee-Ming Ting, Sharon L. Tracy, Robert M. Troncillito, Vivek M. Sura, Donald R. Wall, Giai V. Yen
  • Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
    Patent number: 5304517
    Abstract: A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: April 19, 1994
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, Sylvia M. DeCarr, Srinivasa S. N. Reddy, Subhash L. Shinde, Vivek M. Sura, Rao R. Tummala