Patents by Inventor Vivek Ramadoss

Vivek Ramadoss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packaging with a variable thickness mold cap
    Patent number: 8753926
    Abstract: An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: June 17, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Christopher J. Healy, Gopal C. Jha, Vivek Ramadoss
  • Hybrid multilayer substrate
    Patent number: 8546921
    Abstract: A hybrid multilayer substrate in an electronic package. The substrate includes a first portion having m layers and a second portion having n layers such that m is less than n. The first portion has a first height and the second portion has a second height. The first height is different than the second height. In another embodiment, a surface is formed between the first portion and the second portion, and a shielding material can be applied to the surface. In a different embodiment, the hybrid multilayer substrate is manufactured for shielding a first die from a second die.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: October 1, 2013
    Assignee: QUALCOMM Incorporated
    Inventors: Vivek Ramadoss, Gopal C. Jha, Christopher J. Healy
  • Electronic Packaging With A Variable Thickness Mold Cap
    Publication number: 20120061857
    Abstract: An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 15, 2012
    Applicant: QUALCOMM Incorporated
    Inventors: Vivek Ramadoss, Gopal C. Jha, Christopher J. Healy
  • Hybrid Multilayer Substrate
    Publication number: 20120049333
    Abstract: A hybrid multilayer substrate in an electronic package. The substrate includes a first portion having m layers and a second portion having n layers such that m is less than n. The first portion has a first height and the second portion has a second height. The first height is different than the second height. In another embodiment, a surface is formed between the first portion and the second portion, and a shielding material can be applied to the surface. In a different embodiment, the hybrid multilayer substrate is manufactured for shielding a first die from a second die.
    Type: Application
    Filed: August 24, 2010
    Publication date: March 1, 2012
    Applicant: QUALCOMM INCORPORATED
    Inventors: Vivek Ramadoss, Gopal C. Jha, Christopher J. Healy